Datasheet ADA4004-1, ADA4004-2, ADA4004-4 (Analog Devices) - 13

Data Sheet ADA4004-1/ADA4004-2/ADA4004-4 3.20 3.00 2.80 8 5 5.15 3.20 4.90 3.00 4.65 1 2.80 4 PIN 1 IDENTIFIER 0.65 BSC 0.95 15° MAX 0.85 1.10 MAX 0.75 0.80 0.15 6° 0.23 0.55 0.40 0.05 0° 0.09 0.40 0.25 COPLANARITY 0.10 07-2009-B COMPLIANT TO JEDEC STANDARDS MO-187-AA 10-
Figure 42. 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters
4.10 0.35 4.00 SQ 0.30 3.90 PIN 1 0.25 PIN 1 INDICATOR 13 16 INDICATOR 0.65 12 1 BSC EXPOSED 2.25 PAD 2.10 SQ 1.95 9 4 8 5 0.70 0.25 MIN TOP VIEW BOTTOM VIEW 0.60 0.50 0.80 FOR PROPER CONNECTION OF 0.75 THE EXPOSED PAD, REFER TO 0.05 MAX THE PIN CONFIGURATION AND 0.70 0.02 NOM FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COPLANARITY SEATING 0.08 PLANE 0.20 REF A 908- COMPLIANT TO JEDEC STANDARDS MO-220-WGGC. 111
Figure 43. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 4 mm × 4 mm Body, Very Very Thin Quad (CP-16-23) Dimensions shown in millimeters
8.75 (0.3445) 8.55 (0.3366) 14 8 4.00 (0.1575) 6.20 (0.2441) 1 3.80 (0.1496) 7 5.80 (0.2283) 1.27 (0.0500) 0.50 (0.0197) BSC 45° 1.75 (0.0689) 0.25 (0.0098) 0.25 (0.0098) 1.35 (0.0531) 8° 0.10 (0.0039) 0° COPLANARITY SEATING 0.10 0.51 (0.0201) 1.27 (0.0500) PLANE 0.25 (0.0098) 0.31 (0.0122) 0.40 (0.0157) 0.17 (0.0067) COMPLIANT TO JEDEC STANDARDS MS-012-AB CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS A (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR 0606- REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 06
Figure 44. 14-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-14) Dimensions shown in millimeters and (inches) Rev. H | Page 13 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE