Datasheet AD8605, AD8606, AD8608 (Analog Devices) - 23
| Fabricante | Analog Devices |
| Descripción | Low Noise, CMOS, Rail-to-Rail, Input/Output Precision Quad Op Amp |
| Páginas / Página | 24 / 23 — Data Sheet. AD8605/AD8606/AD8608. 1.480 1.430 1.380. BALL A1. IDENTIFIER. … |
| Revisión | O |
| Formato / tamaño de archivo | PDF / 850 Kb |
| Idioma del documento | Inglés |
Data Sheet. AD8605/AD8606/AD8608. 1.480 1.430 1.380. BALL A1. IDENTIFIER. 1.825 1.775. 1.00. 1.725. REF. 0.50. BSC. TOP VIEW. BOTTOM VIEW
Línea de modelo para esta hoja de datos
AD8606
Versión de texto del documento
Data Sheet AD8605/AD8606/AD8608 1.480 1.430 1.380 3 2 1 A BALL A1 IDENTIFIER 1.825 1.775 1.00 1.725 REF B C 0.50 BSC TOP VIEW BOTTOM VIEW (BALL SIDE DOWN) (BALL SIDE UP) 0.380 0.675 0.355 0.595 SIDE VIEW 0.330 0.515 COPLANARITY 0.05 0.27 SEATING 0.340 A 0.24 PLANE 0.320 0.21 2012- 0.300 10- 08-
Figure 62. 8-Ball Wafer Level Chip Scale Package [WLCSP] (CB-8-1) Dimensions shown in millimeters
8.75 (0.3445) 8.55 (0.3366) 14 8 4.00 (0.1575) 6.20 (0.2441) 1 3.80 (0.1496) 7 5.80 (0.2283) 1.27 (0.0500) 0.50 (0.0197) BSC 45° 1.75 (0.0689) 0.25 (0.0098) 0.25 (0.0098) 1.35 (0.0531) 8° 0.10 (0.0039) 0° COPLANARITY SEATING 0.10 0.51 (0.0201) 1.27 (0.0500) PLANE 0.25 (0.0098) 0.31 (0.0122) 0.40 (0.0157) 0.17 (0.0067) COMPLIANT TO JEDEC STANDARDS MS-012-AB CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS A (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 060606-
Figure 63. 14-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-14) Dimensions shown in millimeters and (inches) Rev. N | Page 23 of 24 Document Outline Features Applications General Description Pin Configurations Revision History 5 V Electrical Specifications 2.7 V Electrical Specifications Absolute Maximum Ratings ESD Caution Typical Performance Characteristics Applications Information Output Phase Reversal Maximum Power Dissipation Input Overvoltage Protection THD + Noise Total Noise Including Source Resistors Channel Separation Capacitive Load Drive Light Sensitivity WLCSP Assembly Considerations I-V Conversion Applications Photodiode Preamplifier Applications Audio and PDA Applications Instrumentation Amplifiers DAC Conversion Outline Dimensions Ordering Guide
Figure 62. 8-Ball Wafer Level Chip Scale Package [WLCSP] (CB-8-1) Dimensions shown in millimeters
8.75 (0.3445) 8.55 (0.3366) 14 8 4.00 (0.1575) 6.20 (0.2441) 1 3.80 (0.1496) 7 5.80 (0.2283) 1.27 (0.0500) 0.50 (0.0197) BSC 45° 1.75 (0.0689) 0.25 (0.0098) 0.25 (0.0098) 1.35 (0.0531) 8° 0.10 (0.0039) 0° COPLANARITY SEATING 0.10 0.51 (0.0201) 1.27 (0.0500) PLANE 0.25 (0.0098) 0.31 (0.0122) 0.40 (0.0157) 0.17 (0.0067) COMPLIANT TO JEDEC STANDARDS MS-012-AB CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS A (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 060606-
Figure 63. 14-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-14) Dimensions shown in millimeters and (inches) Rev. N | Page 23 of 24 Document Outline Features Applications General Description Pin Configurations Revision History 5 V Electrical Specifications 2.7 V Electrical Specifications Absolute Maximum Ratings ESD Caution Typical Performance Characteristics Applications Information Output Phase Reversal Maximum Power Dissipation Input Overvoltage Protection THD + Noise Total Noise Including Source Resistors Channel Separation Capacitive Load Drive Light Sensitivity WLCSP Assembly Considerations I-V Conversion Applications Photodiode Preamplifier Applications Audio and PDA Applications Instrumentation Amplifiers DAC Conversion Outline Dimensions Ordering Guide