Datasheet LT3479 (Analog Devices) - 18
| Fabricante | Analog Devices |
| Descripción | 3A, Full Featured DC/DC Converter with Soft-Start and Inrush Current Protection |
| Páginas / Página | 20 / 18 — PACKAGE DESCRIPTION. DE Package. 14-Lead Plastic DFN (4mm. 3mm) |
| Formato / tamaño de archivo | PDF / 256 Kb |
| Idioma del documento | Inglés |
PACKAGE DESCRIPTION. DE Package. 14-Lead Plastic DFN (4mm. 3mm)
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LT3479
PACKAGE DESCRIPTION DE Package 14-Lead Plastic DFN (4mm
×
3mm)
(Reference LTC DWG # 05-08-1708 Rev B) 0.70 ±0.05 3.60 ±0.05 3.30 ±0.05 2.20 ±0.05 1.70 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 3.00 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 4.00 ±0.10 0.40 ± 0.10 TYP (2 SIDES) 8 14 R = 0.05 TYP 3.30 ±0.10 3.00 ±0.10 (2 SIDES) 1.70 ± 0.10 PIN 1 NOTCH PIN 1 R = 0.20 OR TOP MARK 0.35 × 45° (SEE NOTE 6) CHAMFER (DE14) DFN 0806 REV B 7 1 0.200 REF 0.75 ±0.05 0.25 ± 0.05 0.50 BSC 3.00 REF 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3479fc 18
PACKAGE DESCRIPTION DE Package 14-Lead Plastic DFN (4mm
×
3mm)
(Reference LTC DWG # 05-08-1708 Rev B) 0.70 ±0.05 3.60 ±0.05 3.30 ±0.05 2.20 ±0.05 1.70 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 3.00 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 4.00 ±0.10 0.40 ± 0.10 TYP (2 SIDES) 8 14 R = 0.05 TYP 3.30 ±0.10 3.00 ±0.10 (2 SIDES) 1.70 ± 0.10 PIN 1 NOTCH PIN 1 R = 0.20 OR TOP MARK 0.35 × 45° (SEE NOTE 6) CHAMFER (DE14) DFN 0806 REV B 7 1 0.200 REF 0.75 ±0.05 0.25 ± 0.05 0.50 BSC 3.00 REF 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3479fc 18