Datasheet AD7714 (Analog Devices) - 41
| Fabricante | Analog Devices |
| Descripción | CMOS, 3V/5V, 500 µA, 24-Bit Sigma-Delta, Signal Conditioning ADC |
| Páginas / Página | 41 / 41 — AD7714. OUTLINE DIMENSIONS. 24-Lead Plastic DIP. 24-Lead Thin Shrink … |
| Revisión | C |
| Formato / tamaño de archivo | PDF / 352 Kb |
| Idioma del documento | Inglés |
AD7714. OUTLINE DIMENSIONS. 24-Lead Plastic DIP. 24-Lead Thin Shrink Small Outline Package TSSOP. (N-24). (RU-24). 1.228 (31.19)
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Versión de texto del documento
AD7714 OUTLINE DIMENSIONS
Dimensions are shown in inches and (mm).
24-Lead Plastic DIP 24-Lead Thin Shrink Small Outline Package TSSOP (N-24) (RU-24) 1.228 (31.19) 0.311 (7.90) 1.226 (31.14) 0.303 (7.70) 24 13 0.260 ± 0.001 (6.61 ± 0.03) 24 13 1 12 0.32 (8.128) 0.30 (7.62) PIN 1 0.130 (3.30) 0.128 (7.62) 0.177 (4.50) 0.169 (4.30) 0.256 (6.50) 0.246 (6.25) 1 12
C1972a–0–6/98
0.011 (0.28) 0.02 (0.5) 0.11 (2.79) 0.07 (1.78) SEATING 15 0.009 (0.23)
8
0.006 (0.15) PIN 1 0.019 (0.41) 0.016 (2.28) PLANE 0.05 (1.27) 0 0.002 (0.05) 0.0433 NOTES: (1.10) MAX 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH 8 0.028 (0.70)
8
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED 0.0256 (0.65) 0.0118 (0.30) 0
8
0.020 (0.50) SEATING IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. BSC 0.0079 (0.20) 0.0075 (0.19) PLANE 0.0035 (0.090) 24-Lead Wide Body SOIC 28-Lead Shrink Small Outline Package SSOP (R-24) (RS-28) 0.608 (15.45) 0.407 (10.34) 0.596 (15.13) 0.397 (10.08) 24 13 0.299 (7.6) 28 15 0.291 (7.39) 0.212 (5.38) 0.414 (10.52) 0.205 (5.207) 1 12 0.398 (10.10) 0.311 (7.9) 0.301 (7.64) 1 14 PIN 1 0.096 (204) 0.03 (0.76) 0.089 (2.26) 0.02 (0.51) PIN 1 0.07 (1.79) 0.066 (1.67) 8
8
0.01 (0.254) 0.05 (1.27) 0.019 (0.49) SEATING 0
8
BSC 0.0500 (1.27) 0.014 (0.35) PLANE 0.006 (0.15) 0.013 (0.32) 8
8
0.03 (0.762) 0.0157 (0.40) 0.009 (0.23) 0.0256 (0.65) 0
8
0.008 (0.203) 0.022 (0.558) SEATING NOTES: 0.009 (0.229) BSC PLANE 1. LEAD NO. 1 IDENTIFIED BY DOT. 0.002 (0.050) 0.005 (0.127) 2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. NOTES: 1. LEAD NO. 1 IDENTIFIED BY DOT. 2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
PRINTED IN U.S.A. –40– REV. C
Dimensions are shown in inches and (mm).
24-Lead Plastic DIP 24-Lead Thin Shrink Small Outline Package TSSOP (N-24) (RU-24) 1.228 (31.19) 0.311 (7.90) 1.226 (31.14) 0.303 (7.70) 24 13 0.260 ± 0.001 (6.61 ± 0.03) 24 13 1 12 0.32 (8.128) 0.30 (7.62) PIN 1 0.130 (3.30) 0.128 (7.62) 0.177 (4.50) 0.169 (4.30) 0.256 (6.50) 0.246 (6.25) 1 12
C1972a–0–6/98
0.011 (0.28) 0.02 (0.5) 0.11 (2.79) 0.07 (1.78) SEATING 15 0.009 (0.23)
8
0.006 (0.15) PIN 1 0.019 (0.41) 0.016 (2.28) PLANE 0.05 (1.27) 0 0.002 (0.05) 0.0433 NOTES: (1.10) MAX 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH 8 0.028 (0.70)
8
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED 0.0256 (0.65) 0.0118 (0.30) 0
8
0.020 (0.50) SEATING IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. BSC 0.0079 (0.20) 0.0075 (0.19) PLANE 0.0035 (0.090) 24-Lead Wide Body SOIC 28-Lead Shrink Small Outline Package SSOP (R-24) (RS-28) 0.608 (15.45) 0.407 (10.34) 0.596 (15.13) 0.397 (10.08) 24 13 0.299 (7.6) 28 15 0.291 (7.39) 0.212 (5.38) 0.414 (10.52) 0.205 (5.207) 1 12 0.398 (10.10) 0.311 (7.9) 0.301 (7.64) 1 14 PIN 1 0.096 (204) 0.03 (0.76) 0.089 (2.26) 0.02 (0.51) PIN 1 0.07 (1.79) 0.066 (1.67) 8
8
0.01 (0.254) 0.05 (1.27) 0.019 (0.49) SEATING 0
8
BSC 0.0500 (1.27) 0.014 (0.35) PLANE 0.006 (0.15) 0.013 (0.32) 8
8
0.03 (0.762) 0.0157 (0.40) 0.009 (0.23) 0.0256 (0.65) 0
8
0.008 (0.203) 0.022 (0.558) SEATING NOTES: 0.009 (0.229) BSC PLANE 1. LEAD NO. 1 IDENTIFIED BY DOT. 0.002 (0.050) 0.005 (0.127) 2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. NOTES: 1. LEAD NO. 1 IDENTIFIED BY DOT. 2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
PRINTED IN U.S.A. –40– REV. C