Datasheet MCP4902, MCP4912, MCP4922 (Microchip) - 3

FabricanteMicrochip
Descripción8/10/12-Bit Dual Voltage Output Digital-to-Analog Converter with SPI Interface
Páginas / Página48 / 3 — MCP4902/4912/4922. 1.0. ELECTRICAL. † Notice:. CHARACTERISTICS. Absolute …
Formato / tamaño de archivoPDF / 3.8 Mb
Idioma del documentoInglés

MCP4902/4912/4922. 1.0. ELECTRICAL. † Notice:. CHARACTERISTICS. Absolute Maximum Ratings †. ELECTRICAL CHARACTERISTICS

MCP4902/4912/4922 1.0 ELECTRICAL † Notice: CHARACTERISTICS Absolute Maximum Ratings † ELECTRICAL CHARACTERISTICS

Línea de modelo para esta hoja de datos

Versión de texto del documento

link to page 3 link to page 3 link to page 3
MCP4902/4912/4922 1.0 ELECTRICAL † Notice:
Stresses above those listed under “Maximum
CHARACTERISTICS
Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those
Absolute Maximum Ratings †
indicated in the operational listings of this specification V is not implied. Exposure to maximum rating conditions DD... 6.5V for extended periods may affect device reliability. All inputs and outputs w.r.t ...VSS –0.3V to VDD+0.3V Current at Input Pins ... ±2 mA Current at Supply Pins .. ±50 mA Current at Output Pins .. ±25 mA Storage temperature .. -65°C to +150°C Ambient temp. with power applied ... -55°C to +125°C ESD protection on all pins 4 kV (HBM), 400V (MM) Maximum Junction Temperature (TJ)..+150°C
ELECTRICAL CHARACTERISTICS Electrical Specifications:
Unless otherwise indicated, VDD = 5V, VSS = 0V, VREF = 2.048V, Output Buffer Gain (G) = 2x, RL = 5 k to GND, CL = 100 pF TA = -40 to +85°C. Typical values are at +25°C.
Parameters Sym Min Typ Max Units Conditions Power Requirements
Operating Voltage VDD 2.7 — 5.5 V Operating CurrentInput Cur- IDD — 350 700 µA VDD = 5V rent V — 250 500 µA DD = 3V VREF input is unbuffered, all digital inputs are grounded, all analog outputs (VOUT) are unloaded. Code = 000h. Hardware Shutdown Current ISHDN — 0.3 2 µA Power-on Reset circuit is turned off Software Shutdown Current ISHDN_SW — 3.3 6 µA Power-on Reset circuit stays on Power-on-Reset Threshold VPOR — 2.0 — V
DC Accuracy MCP4902
Resolution n 8 — — Bits INL Error INL -1 ±0.125 1 LSb DNL

DNL -0.5 ±0.1 +0.5 LSb
Note 1 MCP4912
Resolution n 10 — — Bits INL Error INL -3.5 ±0.5 3.5 LSb DNL DNL -0.5 ±0.1 +0.5 LSb
Note 1 MCP4922
Resolution n 12 — — Bits INL Error INL -12 ±2 12 LSb DNL DNL -0.75 ±0.2 +0.75 LSb
Note 1
Offset Error VOS — ±0.02 1 % of Code = 0x000h FSR
Note 1:
Guaranteed monotonic by design over all codes.
2:
This parameter is ensured by design, and not 100% tested.  2010 Microchip Technology Inc. DS22250A-page 3 Document Outline 1.0 Electrical Characteristics FIGURE 1-1: SPI Input Timing Data. 2.0 Typical Performance Curves FIGURE 2-1: DNL vs. Code (MCP4922). FIGURE 2-2: DNL vs. Code and Temperature (MCP4922). FIGURE 2-3: DNL vs. Code and VREF, Gain = 1 (MCP4922). FIGURE 2-4: Absolute DNL vs. Temperature (MCP4922). FIGURE 2-5: Absolute DNL vs. Voltage Reference (MCP4922). FIGURE 2-6: INL vs. Code and Temperature (MCP4922). FIGURE 2-7: Absolute INL vs. Temperature (MCP4922). FIGURE 2-8: Absolute INL vs. VREF (MCP4922). FIGURE 2-9: INL vs. Code and VREF (MCP4922). FIGURE 2-10: INL vs. Code (MCP4922). FIGURE 2-11: DNL vs. Code and Temperature (MCP4912). FIGURE 2-12: INL vs. Code and Temperature (MCP4912). FIGURE 2-13: DNL vs. Code and Temperature (MCP4902). FIGURE 2-14: INL vs. Code and Temperature (MCP4902). FIGURE 2-15: IDD vs. Temperature and VDD. FIGURE 2-16: IDD Histogram (VDD = 2.7V). FIGURE 2-17: IDD Histogram (VDD = 5.0V). FIGURE 2-18: Hardware Shutdown Current vs. Ambient Temperature and VDD. FIGURE 2-19: Software Shutdown Current vs. Ambient Temperature and VDD. FIGURE 2-20: Offset Error vs. Ambient Temperature and VDD. FIGURE 2-21: Gain Error vs. Ambient Temperature and VDD. FIGURE 2-22: VIN High Threshold vs Ambient Temperature and VDD. FIGURE 2-23: VIN Low Threshold vs Ambient Temperature and VDD. FIGURE 2-24: Input Hysteresis vs. Ambient Temperature and VDD. FIGURE 2-25: VREF Input Impedance vs. Ambient Temperature and VDD. FIGURE 2-26: VOUT High Limit vs. Ambient Temperature and VDD. FIGURE 2-27: VOUT Low Limit vs. Ambient Temperature and VDD. FIGURE 2-28: IOUT High Short vs. Ambient Temperature and VDD. FIGURE 2-29: IOUT vs VOUT. Gain = 1x. FIGURE 2-30: VOUT Rise Time. FIGURE 2-31: VOUT Fall Time. FIGURE 2-32: VOUT Rise Time. FIGURE 2-33: VOUT Rise Time. FIGURE 2-34: VOUT Rise Time Exit Shutdown. FIGURE 2-35: PSRR vs. Frequency. FIGURE 2-36: Multiplier Mode Bandwidth. FIGURE 2-37: -3 db Bandwidth vs. Worst Codes. FIGURE 2-38: Phase Shift. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Supply Voltage Pins (VDD, VSS) 3.2 Chip Select (CS) 3.3 Serial Clock Input (SCK) 3.4 Serial Data Input (SDI) 3.5 Latch DAC Input (LDAC) 3.6 Hardware Shutdown Input (SHDN) 3.7 Analog Outputs (VOUTA, VOUTB) 3.8 Voltage Reference Inputs (VREFA, VREFB) 4.0 General Overview TABLE 4-1: LSb of each device 4.1 DC Accuracy FIGURE 4-1: Example for INL Error. FIGURE 4-2: Example for DNL Accuracy. 4.2 Circuit Descriptions FIGURE 4-3: Typical Transient Response. FIGURE 4-4: Output Stage for Shutdown Mode. 5.0 Serial Interface 5.1 Overview 5.2 Write Command FIGURE 5-1: Write Command for MCP4922 (12-bit DAC). FIGURE 5-2: Write Command for MCP4912 (10-bit DAC). FIGURE 5-3: Write Command for MCP4902 (8-bit DAC). 6.0 Typical Applications 6.1 Digital Interface 6.2 Power Supply Considerations FIGURE 6-1: Typical Connection Diagram. 6.3 Layout Considerations 6.4 Single-Supply Operation 6.5 Bipolar Operation 6.6 Selectable Gain and Offset Bipolar Voltage Output Using a Dual DAC 6.7 Designing a Double-Precision DAC Using a Dual DAC 6.8 Building Programmable Current Source 6.9 Using Multiplier Mode 7.0 Development support 7.1 Evaluation and Demonstration Boards 8.0 Packaging Information 8.1 Package Marking Information Trademarks Worldwide Sales and Service