Datasheet E522.80, E522.81, E522.82, E522.83 (Elmos) - 22
| Fabricante | Elmos |
| Descripción | Triple 150mA Linear LED Controller |
| Páginas / Página | 25 / 22 — ecif. ication. Package Outline Specification. 08SP0637.01 |
| Formato / tamaño de archivo | PDF / 1.2 Mb |
| Idioma del documento | Inglés |
ecif. ication. Package Outline Specification. 08SP0637.01
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Triple 150mA Linear LED Controller E522.80/81/82/83 Production Data - May 5, 2017 6
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Package Outline Specification 08SP0637.01
16 lead small outline package (150mil) All devices are available in a Pb free, RoHs compliant SOIC16N-EP plastic package according to JEDEC MS-012-F, variant BC. The with exposed pad package is classified to Moisture Sensitivity Level 3 (MSL 3) according to JEDEC J-STD-020 with a soldering peak temperature (SO16n - ep) of (260+5)°C.
Package Outline and Dimensions are according JEDEC MS-012-F, variant BC. mm inch Description Symbol min typ max min typ max
Package height A -- -- 1.75 -- -- 0.067 Stand off A1 0.00 -- 0.15 0.000 -- 0.006 Package body thickness A2 1.25 -- -- 0.049 -- -- Width of terminal leads, inclusive lead finish b 0.31 -- 0.51 0.012 -- 0.020 Thickness of terminal leads, inclusive lead finish c 0.10 -- 0.25 0.004 -- 0.010 Package length D 9.90 BSC 0.390 BSC Exposed pad length D1 2.290 2.540 2.800 0.090 0.100 0.110 Package width E 6.00 BSC 0.236 BSC Package body width E1 3.90 BSC 0.154 BSC Exposed pad width E2 1.780 2.030 2.290 0.070 0.080 0.090 Lead pitch e 1.27 BSC 0.050 BSC Length of terminal for soldering to substrate L 0.4 -- 1.27 0.016 -- 0.050 body chamfer (45°) h 0.25 -- 0.50 0.010 -- 0.020 Angle of lead mounting area phi [°] 0 -- 8 0 -- 8 mold release angle phi1 [°] 5 -- 15 5 -- 15 Number of terminal positions N 16 16
Note:
the mm values are valid, the inch values contains rounding errors
Note 1:
for assembler specific pin1 identification please see QM-document 08SP0363.xx (Pin 1 Specification) Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. Elmos Semic 27/03/15 onductor A ©Elm G os GROUP / Tr ansfer, repr Da oduction, distributi ta Sheet on and/or editing, in part or completely, without the pQM-No rior .: 25DS0132E.03 Page 1 of 1 written consent, are prohibited. 22/25
S
P
p
ack
ecif
age R
ication
eferenceTitle: QM-No.:
Package Outline Specification 08SP0637.01
16 lead small outline package (150mil) All devices are available in a Pb free, RoHs compliant SOIC16N-EP plastic package according to JEDEC MS-012-F, variant BC. The with exposed pad package is classified to Moisture Sensitivity Level 3 (MSL 3) according to JEDEC J-STD-020 with a soldering peak temperature (SO16n - ep) of (260+5)°C.
Package Outline and Dimensions are according JEDEC MS-012-F, variant BC. mm inch Description Symbol min typ max min typ max
Package height A -- -- 1.75 -- -- 0.067 Stand off A1 0.00 -- 0.15 0.000 -- 0.006 Package body thickness A2 1.25 -- -- 0.049 -- -- Width of terminal leads, inclusive lead finish b 0.31 -- 0.51 0.012 -- 0.020 Thickness of terminal leads, inclusive lead finish c 0.10 -- 0.25 0.004 -- 0.010 Package length D 9.90 BSC 0.390 BSC Exposed pad length D1 2.290 2.540 2.800 0.090 0.100 0.110 Package width E 6.00 BSC 0.236 BSC Package body width E1 3.90 BSC 0.154 BSC Exposed pad width E2 1.780 2.030 2.290 0.070 0.080 0.090 Lead pitch e 1.27 BSC 0.050 BSC Length of terminal for soldering to substrate L 0.4 -- 1.27 0.016 -- 0.050 body chamfer (45°) h 0.25 -- 0.50 0.010 -- 0.020 Angle of lead mounting area phi [°] 0 -- 8 0 -- 8 mold release angle phi1 [°] 5 -- 15 5 -- 15 Number of terminal positions N 16 16
Note:
the mm values are valid, the inch values contains rounding errors
Note 1:
for assembler specific pin1 identification please see QM-document 08SP0363.xx (Pin 1 Specification) Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. Elmos Semic 27/03/15 onductor A ©Elm G os GROUP / Tr ansfer, repr Da oduction, distributi ta Sheet on and/or editing, in part or completely, without the pQM-No rior .: 25DS0132E.03 Page 1 of 1 written consent, are prohibited. 22/25