Datasheet 6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 (Broadcom) - 25
| Fabricante | Broadcom |
| Descripción | High CMR, High Speed TTL Compatible Optocouplers 6N137, HCPL-26xx/06xx/4661, HCNW137/26x1 |
| Páginas / Página | 29 / 25 — Figure 13 Test Circuit for tEHL and tELH. PULSE GEN. Z = 50. t = t = 5 … |
| Formato / tamaño de archivo | PDF / 1.3 Mb |
| Idioma del documento | Inglés |
Figure 13 Test Circuit for tEHL and tELH. PULSE GEN. Z = 50. t = t = 5 ns. INPUT VE. MONITORING NODE. +5 V. 3.0 V. INPUT. 1.5 V. 7.5 mA
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6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, Package Characteristics HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 Data Sheet
Figure 13 Test Circuit for tEHL and tELH PULSE GEN. Z = 50 O
W
t = t = 5 ns f r INPUT VE MONITORING NODE +5 V 1 CC V 8 3.0 V INPUT V 1.5 V 7.5 mA 0.1 μF E 2 R 7 L I BYPASS F tEHL t ELH OUTPUT V O 3 6 MONITORING OUTPUT NODE O V *C 1.5 V L 4 5 GND *C IS APPROXIMATELY 15 pF WHICH INCLUDES L PROBE AND STRAY WIRING CAPACITANCE. Figure 14 Typical Enable Propagation Delay vs. Temperature 120 VCC = 5.0 V VEH = 3.0 V VEL = 0 V 90 IF = 7.5 mA tELH, RL = 4 k
W
60 tELH, RL = 1 k
W
30 tELH, RL = 350
W
– ENABLE PROPAGATION DELAY – ns t E tEHL, RL = 350
W,
1 k
W,
4 k
W
0-60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – °C Figure 15 Test Circuit for Common Mode Transient Immunity and Typical Waveforms IF SINGLE CHANNEL DUAL CHANNEL I B F 1 VCC 8 +5 V 1 VCC 8 +5 V A B R 0.1 μF L OUTPUT V O 2 7 BYPASS R 2 7 MONITORING A L V NODE OUTPUT V FF O VFF 3 6 MONITORING 3 6 0.1 μF NODE BYPASS GND 4 5 GND 4 5 VCM VCM + – + – PULSE PULSE GENERATOR GENERATOR Z = 50 O
W
Z = 50 O
W
CM V (PEAK) VCM 0 V SWITCH AT A: I = 0 mA F 5 V CM H VO O V (MIN.) SWITCH AT B: I = 7.5 mA F V O V (MAX.) O 0.5 V CM L
Avago Technologies - 25 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew
Figure 13 Test Circuit for tEHL and tELH PULSE GEN. Z = 50 O
W
t = t = 5 ns f r INPUT VE MONITORING NODE +5 V 1 CC V 8 3.0 V INPUT V 1.5 V 7.5 mA 0.1 μF E 2 R 7 L I BYPASS F tEHL t ELH OUTPUT V O 3 6 MONITORING OUTPUT NODE O V *C 1.5 V L 4 5 GND *C IS APPROXIMATELY 15 pF WHICH INCLUDES L PROBE AND STRAY WIRING CAPACITANCE. Figure 14 Typical Enable Propagation Delay vs. Temperature 120 VCC = 5.0 V VEH = 3.0 V VEL = 0 V 90 IF = 7.5 mA tELH, RL = 4 k
W
60 tELH, RL = 1 k
W
30 tELH, RL = 350
W
– ENABLE PROPAGATION DELAY – ns t E tEHL, RL = 350
W,
1 k
W,
4 k
W
0-60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – °C Figure 15 Test Circuit for Common Mode Transient Immunity and Typical Waveforms IF SINGLE CHANNEL DUAL CHANNEL I B F 1 VCC 8 +5 V 1 VCC 8 +5 V A B R 0.1 μF L OUTPUT V O 2 7 BYPASS R 2 7 MONITORING A L V NODE OUTPUT V FF O VFF 3 6 MONITORING 3 6 0.1 μF NODE BYPASS GND 4 5 GND 4 5 VCM VCM + – + – PULSE PULSE GENERATOR GENERATOR Z = 50 O
W
Z = 50 O
W
CM V (PEAK) VCM 0 V SWITCH AT A: I = 0 mA F 5 V CM H VO O V (MIN.) SWITCH AT B: I = 7.5 mA F V O V (MAX.) O 0.5 V CM L
Avago Technologies - 25 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew