Datasheet PCF8574, PCF8574A (NXP) - 4

NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 6. Pinning information 6.1 Pinning
A0 1 16 VDD A1 2 15 SDA INT 1 20 P7 SCL 2 19 P6 A2 3 14 SCL A0 1 16 VDD n.c. 3 18 n.c. P0 4 13 INT SDA 4 17 P5
PCF8574P
A1 2 15 SDA
PCF8574AP
A2 3 14 SCL V 5 DD
PCF8574TS/3
16 P4 P1 5 12 P7 P0 4
PCF8574T/3
13 INT A0 6
PCF8574ATS/3
15 VSS P2 6 11 P6 P1 5
PCF8574AT/3
12 P7 A1 7 14 P3 P2 6 11 P6 n.c. 8 13 n.c. P3 7 10 P5 P3 7 10 P5 A2 9 12 P2 VSS 8 9 P4 VSS 8 9 P4 P0 10 11 P1 002aad625 002aad626 002aad627
Fig 3. Pin configuration for DIP16 Fig 4. Pin configuration for SO16 Fig 5. Pin configuration for SSOP20 6.2 Pin description Table 3. Pin description Symbol Pin Description DIP16, SO16 SSOP20
A0 1 6 address input 0 A1 2 7 address input 1 A2 3 9 address input 2 P0 4 10 quasi-bidirectional I/O 0 P1 5 11 quasi-bidirectional I/O 1 P2 6 12 quasi-bidirectional I/O 2 P3 7 14 quasi-bidirectional I/O 3 VSS 8 15 supply ground P4 9 16 quasi-bidirectional I/O 4 P5 10 17 quasi-bidirectional I/O 5 P6 11 19 quasi-bidirectional I/O 6 P7 12 20 quasi-bidirectional I/O 7 INT 13 1 interrupt output (active LOW) SCL 14 2 serial clock line SDA 15 4 serial data line VDD 16 5 supply voltage n.c. - 3, 8, 13, 18 not connected PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 27 May 2013 4 of 33
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Ordering information 4.1 Ordering options 5. Block diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Device address 7.1.1 Address maps 8. I/O programming 8.1 Quasi-bidirectional I/Os 8.2 Writing to the port (Output mode) 8.3 Reading from a port (Input mode) 8.4 Power-on reset 8.5 Interrupt output (INT) 9. Characteristics of the I2C-bus 9.1 Bit transfer 9.1.1 START and STOP conditions 9.2 System configuration 9.3 Acknowledge 10. Application design-in information 10.1 Bidirectional I/O expander applications 10.2 How to read and write to I/O expander (example) 10.3 High current-drive load applications 10.4 Migration path 11. Limiting values 12. Thermal characteristics 13. Static characteristics 14. Dynamic characteristics 15. Package outline 16. Handling information 17. Soldering of SMD packages 17.1 Introduction to soldering 17.2 Wave and reflow soldering 17.3 Wave soldering 17.4 Reflow soldering 18. Soldering of through-hole mount packages 18.1 Introduction to soldering through-hole mount packages 18.2 Soldering by dipping or by solder wave 18.3 Manual soldering 18.4 Package related soldering information 19. Soldering: PCB footprints 20. Abbreviations 21. Revision history 22. Legal information 22.1 Data sheet status 22.2 Definitions 22.3 Disclaimers 22.4 Trademarks 23. Contact information 24. Contents