Datasheet LT1021 (Analog Devices) - 15
| Fabricante | Analog Devices |
| Descripción | Precision Reference |
| Páginas / Página | 16 / 15 — PACKAGE DESCRIPTION. H Package. 8-Lead TO-5 Metal Can (.200 Inch PCD). N8 … |
| Formato / tamaño de archivo | PDF / 239 Kb |
| Idioma del documento | Inglés |
PACKAGE DESCRIPTION. H Package. 8-Lead TO-5 Metal Can (.200 Inch PCD). N8 Package. 8-Lead PDIP (Narrow .300 Inch)
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- 5962-8860001GA 5962-8876201GA 5962-8876202GA LT1021BCH-5 LT1021BCN8-10#PBF LT1021BCN8-5#PBF LT1021BCN8-7#PBF LT1021BMH-10 LT1021BMH-5 LT1021CCH-5 LT1021CCN8-10#PBF LT1021CCN8-5#PBF LT1021CIN8-10#PBF LT1021CIN8-5#PBF LT1021CMH-5 LT1021DCN8-10#PBF LT1021DCN8-5#PBF LT1021DCN8-7#PBF LT1021DCS8-10#PBF LT1021DCS8-10#TRPBF LT1021DCS8-5#PBF LT1021DCS8-5#TRPBF LT1021DCS8-7#PBF LT1021DCS8-7#TRPBF LT1021DIN8-10#PBF LT1021DIN8-5#PBF
Versión de texto del documento
LT1021
U PACKAGE DESCRIPTION H Package 8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320) .335 – .370 (8.509 – 9.398) DIA .305 – .335 (7.747 – 8.509) .040 (1.016) .050 MAX (1.270) .165 – .185 MAX (4.191 – 4.699) REFERENCE SEATING PLANE PLANE GAUGE PLANE .500 – .750 (12.700 – 19.050) .010 – .045* (0.254 – 1.143) .016 – .021** (0.406 – 0.533) .027 – .045 (0.686 – 1.143) 45° PIN 1 .028 – .034 (0.711 – 0.864) .200 (5.080) TYP .110 – .160 (2.794 – 4.064) INSULATING STANDOFF *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND THE SEATING PLANE .016 – .024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610) H8(TO-5) 0.200 PCD 0204
N8 Package 8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510) .400* (10.160) MAX 8 7 6 5 .255 ± .015* (6.477 ± 0.381) 1 2 3 4 .300 – .325 .045 – .065 .130 ± .005 (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) .065 (1.651) .008 – .015 TYP .120 (0.203 – 0.381) (3.048) .020 +.035 MIN (0.508) .325 –.015 MIN .100 .018 ± .003 +0.889 8.255 (2.54) (0.457 ± 0.076) ( ) –0.381 N8 1002 BSC NOTE: INCHES 1. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm) 1021fc Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15
U PACKAGE DESCRIPTION H Package 8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320) .335 – .370 (8.509 – 9.398) DIA .305 – .335 (7.747 – 8.509) .040 (1.016) .050 MAX (1.270) .165 – .185 MAX (4.191 – 4.699) REFERENCE SEATING PLANE PLANE GAUGE PLANE .500 – .750 (12.700 – 19.050) .010 – .045* (0.254 – 1.143) .016 – .021** (0.406 – 0.533) .027 – .045 (0.686 – 1.143) 45° PIN 1 .028 – .034 (0.711 – 0.864) .200 (5.080) TYP .110 – .160 (2.794 – 4.064) INSULATING STANDOFF *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND THE SEATING PLANE .016 – .024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610) H8(TO-5) 0.200 PCD 0204
N8 Package 8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510) .400* (10.160) MAX 8 7 6 5 .255 ± .015* (6.477 ± 0.381) 1 2 3 4 .300 – .325 .045 – .065 .130 ± .005 (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) .065 (1.651) .008 – .015 TYP .120 (0.203 – 0.381) (3.048) .020 +.035 MIN (0.508) .325 –.015 MIN .100 .018 ± .003 +0.889 8.255 (2.54) (0.457 ± 0.076) ( ) –0.381 N8 1002 BSC NOTE: INCHES 1. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm) 1021fc Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15