Datasheet LTC6255, LTC6256, LTC6257 (Analog Devices) - 19
| Fabricante | Analog Devices |
| Descripción | 6.5MHz, 65µA Power Efficient Rail-to-Rail I/O Op Amps |
| Páginas / Página | 26 / 19 — PACKAGE DESCRIPTION. TS8 Package. 8-Lead Plastic TSOT-23 |
| Revisión | E |
| Formato / tamaño de archivo | PDF / 815 Kb |
| Idioma del documento | Inglés |
PACKAGE DESCRIPTION. TS8 Package. 8-Lead Plastic TSOT-23
Línea de modelo para esta hoja de datos
- LTC6255CDC#TRMPBF LTC6255CDC#TRPBF LTC6255CS6#TRMPBF LTC6255CS6#TRPBF LTC6255HS6#TRMPBF LTC6255HS6#TRPBF LTC6255IDC#TRMPBF LTC6255IDC#TRPBF LTC6255IS6#TRMPBF LTC6255IS6#TRPBF
- LTC6256CDC#TRMPBF LTC6256CDC#TRPBF LTC6256CMS#PBF LTC6256CMS#TRPBF LTC6256CMS8#PBF LTC6256CMS8#TRPBF LTC6256CTS8#TRMPBF LTC6256CTS8#TRPBF LTC6256HTS8#TRMPBF LTC6256HTS8#TRPBF LTC6256IDC#TRMPBF LTC6256IDC#TRPBF LTC6256IMS#PBF LTC6256IMS#TRPBF LTC6256IMS8#PBF LTC6256IMS8#TRPBF LTC6256ITS8#TRMPBF LTC6256ITS8#TRPBF
Versión de texto del documento
LTC6255/LTC6256/LTC6257
PACKAGE DESCRIPTION TS8 Package 8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637 Rev A) 2.90 BSC 0.40 0.65 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.22 – 0.36 0.65 BSC PER IPC CALCULATOR 8 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.95 BSC TS8 TSOT-23 0710 REV A (NOTE 3) NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 Rev E For more information www.analog.com 19 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information 5V Electrical Characteristics 1.8V Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Schematic Operation Applications Information Typical Applications Package Description Typical Application Related Parts
PACKAGE DESCRIPTION TS8 Package 8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637 Rev A) 2.90 BSC 0.40 0.65 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.22 – 0.36 0.65 BSC PER IPC CALCULATOR 8 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.95 BSC TS8 TSOT-23 0710 REV A (NOTE 3) NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 Rev E For more information www.analog.com 19 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information 5V Electrical Characteristics 1.8V Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Schematic Operation Applications Information Typical Applications Package Description Typical Application Related Parts