LTC3826-1 PACKAGE DESCRIPTIONG Package28-Lead Plastic SSOP (5.3mm) (Reference LTC DWG # 05-08-1640) 9.90 – 10.50* (.390 – .413) 1.25 ±0.12 28 27 26 25 24 23 22 21 20 19 18 17 16 15 7.8 – 8.2 5.3 – 5.7 7.40 – 8.20 (.291 – .323) 0.42 ±0.03 0.65 BSC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 RECOMMENDED SOLDER PAD LAYOUT 5.00 – 5.60** 2.0 (.197 – .221) (.079) MAX 0° – 8° 0.09 – 0.25 0.55 – 0.95 0.65 (.0035 – .010) (.022 – .037) (.0256) BSC 0.05 0.22 – 0.38 NOTE: (.002) (.009 – .015) 1. CONTROLLING DIMENSION: MILLIMETERS MIN TYP G28 SSOP 0204 MILLIMETERS 2. DIMENSIONS ARE IN (INCHES) 3. DRAWING NOT TO SCALE *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED .152mm (.006") PER SIDE **DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE 38261fb Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 31