Datasheet MAX6627 (Maxim) - 5
| Fabricante | Maxim |
| Descripción | Remote ±1°C Accurate Digital Temperature Sensors with SPI-Compatible Serial Interface |
| Páginas / Página | 10 / 5 — Pin Configurations. SOT23. TDFN. Pin Description. PIN. NAME. FUNCTION |
| Revisión | 7 |
| Formato / tamaño de archivo | PDF / 1.1 Mb |
| Idioma del documento | Inglés |
Pin Configurations. SOT23. TDFN. Pin Description. PIN. NAME. FUNCTION
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MAX6627/MAX6628 Remote ±1°C Accurate Digital Temperature Sensors with SPI-Compatible Serial Interface
Pin Configurations
N.C. SDO CS SCK TOP VIEW 8 7 6 5 GND 1 8 N.C. DXN 2 7 SDO MAX6627 MAX6627 DXP 3 6 CS MAX6628 VCC 4 5 SCK
+
EP
SOT23
1 2 3 4 GND DXN DXP VCC
TDFN Pin Description PIN NAME FUNCTION
1 GND Ground 2 DXN Combined Current Sink and ADC Negative Input for Remote Diode. DXN is normally biased to a diode voltage above ground. 3 DXP Combined Current Source and ADC Positive Input for Remote Diode. Place a 2200pF capacitor between DXP and DXN for noise filtering. 4 VCC Supply Voltage Input. Bypass with a 0.1µF to GND. 5 SCK SPI Clock Input 6 CS Chip-Select Input. Pulling CS low initiates an idle state, but the SPI interface is still enabled. A rising-edge of CS initiates the next conversion. 7 SDO SPI Data Output 8 N.C. No Connect. Internally not connected. Can be connected to GND for improved thermal conductivity. — EP Exposed Pad. Internally connected to GND. Connect to a large ground plane to maximize thermal performance. Not intended as an electrical connection point. www.maximintegrated.com Maxim Integrated │
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Pin Configurations
N.C. SDO CS SCK TOP VIEW 8 7 6 5 GND 1 8 N.C. DXN 2 7 SDO MAX6627 MAX6627 DXP 3 6 CS MAX6628 VCC 4 5 SCK
+
EP
SOT23
1 2 3 4 GND DXN DXP VCC
TDFN Pin Description PIN NAME FUNCTION
1 GND Ground 2 DXN Combined Current Sink and ADC Negative Input for Remote Diode. DXN is normally biased to a diode voltage above ground. 3 DXP Combined Current Source and ADC Positive Input for Remote Diode. Place a 2200pF capacitor between DXP and DXN for noise filtering. 4 VCC Supply Voltage Input. Bypass with a 0.1µF to GND. 5 SCK SPI Clock Input 6 CS Chip-Select Input. Pulling CS low initiates an idle state, but the SPI interface is still enabled. A rising-edge of CS initiates the next conversion. 7 SDO SPI Data Output 8 N.C. No Connect. Internally not connected. Can be connected to GND for improved thermal conductivity. — EP Exposed Pad. Internally connected to GND. Connect to a large ground plane to maximize thermal performance. Not intended as an electrical connection point. www.maximintegrated.com Maxim Integrated │
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