Datasheet ACS724 (Allegro) - 32

Automotive-Grade, Galvanically Isolated Current Sensor IC ACS724 with Common-Mode Field Rejection in a Small-Footprint SOIC8 Package PACKAGE OUTLING DRAWING For Reference Only – Not for Tooling Use
(Reference MS-012AA) Dimensions in millimeters – NOT TO SCALE Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown 4.90 ±0.10 8° 0° 1.67 ±0.10 D 8 0.25 0.17 D1 D2 NNNNNNN 3.90 ±0.10 6.00 ±0.20 PPT-AAA A LLLLL D 1.71 ±0.10 1.04 REF 1 1 2 D 1.27 B Standard Branding Reference View 0.40 N = Device part number 2.45 ±0.10 P = Package Designator T = Device temperature range 0.25 BSC A = Amperage L = Lot number Belly Brand = Country of Origin SEATING PLANE Branded Face GAUGE PLANE C 8X A Terminal #1 mark area 0.10 C 1.75 MAX SEATING PLANE B Branding scale and appearance at supplier discretion C Reference land pattern layout (reference IPC7351 SOIC127P600X175-8M); 0.51 0.25 all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary 0.31 0.10 to meet application process requirements and PCB layout tolerances. 1.27 BSC D Hall elements (D1, D2); not to scale 0.65 1.27 Package Outline 0.65 1.27 8 8 1.27 5.60 7.35 4.20 7.35 1.75 1.575 1 2 1 2 Slot in PCB to maintain C PCB Layout Reference View 1 4.2 mm creepage once PCB Layout Reference View 2 part is on PCB C For PCB assemblies that cannot support a slotted design, the above stretched footprint may be used.
Figure 9: Package LC, 8-pin SOICN
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