High-Accuracy, Hall-Effect-Based Current Sensor ICACS724KMAwith Common-Mode Field Rejection in High-Isolation SOIC16 PackagePACKAGE OUTLINE DRAWINGFor Reference Only – Not for Tooling Use (Reference MS-013AA) NOT TO SCALE Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown 10.30 ±0.20 8° 0° 16 0.33 0.20 7.50 ±0.10 10.30 ±0.33 A 1.27 1.40 REF 0.40 1 2 Branded Face 0.25 BSC SEATING PLANE 16X C 2.65 MAX GAUGE PLANE 0.10 C SEATING PLANE 1.27 BSC 0.30 0.51 0.10 0.31 0.65 1.27 16 NNNNNNN 2.25 LLLLLLLL 1 B Standard Branding Reference View 9.50 N = Device part number L = Assembly Lot Number, first eight characters A Terminal #1 mark area B Branding scale and appearance at supplier discretion 1 2 C Reference land pattern layout (reference IPC7351 SOIC127P600X175-8M); C PCB Layout Reference View all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances Figure 8: Package MA, 16-Pin SOICW 21 Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com