Datasheet ADN2891 (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | 3.3 V, 3.2 Gbps Limiting Amplifier |
| Páginas / Página | 16 / 5 — Data Sheet. ADN2891. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 603 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADN2891. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. THERMAL RESISTANCE. Table 3. Package Type. θJA. Unit
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Data Sheet ADN2891 ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these Power Supply Voltage 4.2 V or any other conditions above those indicated in the operational Minimum Voltage VEE − 0.4 V (All Inputs and Outputs) section of this specification is not implied. Operation beyond Maximum Voltage VCC + 0.4 V the maximum operating conditions for extended periods may (All Inputs and Outputs) affect product reliability. Storage Temperature −65°C to +150°C
THERMAL RESISTANCE
Operating Temperature Range −40°C to +95°C θ Production Soldering Temperature J-STD-20 JA is specified for 4-layer PCB with exposed paddle soldered to GND. Junction Temperature 125°C
Table 3. Package Type θJA Unit
3 mm × 3 mm, 16-lead LFCSP 28 °C/W
ESD CAUTION
Rev. B | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION LIMITING AMPLIFIER Input Buffer CML Output Buffer LOSS OF SIGNAL (LOS) DETECTOR RECEIVED SIGNAL STRENGTH INDICATOR (RSSI) SQUELCH MODE APPLICATIONS PCB DESIGN GUIDELINES Output Buffer Power Supply and Ground Planes PCB Layout Soldering Guidelines for the LFCSP OUTLINE DIMENSIONS ORDERING GUIDE
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these Power Supply Voltage 4.2 V or any other conditions above those indicated in the operational Minimum Voltage VEE − 0.4 V (All Inputs and Outputs) section of this specification is not implied. Operation beyond Maximum Voltage VCC + 0.4 V the maximum operating conditions for extended periods may (All Inputs and Outputs) affect product reliability. Storage Temperature −65°C to +150°C
THERMAL RESISTANCE
Operating Temperature Range −40°C to +95°C θ Production Soldering Temperature J-STD-20 JA is specified for 4-layer PCB with exposed paddle soldered to GND. Junction Temperature 125°C
Table 3. Package Type θJA Unit
3 mm × 3 mm, 16-lead LFCSP 28 °C/W
ESD CAUTION
Rev. B | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION LIMITING AMPLIFIER Input Buffer CML Output Buffer LOSS OF SIGNAL (LOS) DETECTOR RECEIVED SIGNAL STRENGTH INDICATOR (RSSI) SQUELCH MODE APPLICATIONS PCB DESIGN GUIDELINES Output Buffer Power Supply and Ground Planes PCB Layout Soldering Guidelines for the LFCSP OUTLINE DIMENSIONS ORDERING GUIDE