Datasheet ADXL1005 (Analog Devices) - 14
| Fabricante | Analog Devices |
| Descripción | Low Noise, Wide Bandwidth, MEMS Accelerometer |
| Páginas / Página | 14 / 14 — ADXL1005. Data Sheet. OUTLINE DIMENSIONS. DETAIL A. (JEDEC 95). 5.10. … |
| Formato / tamaño de archivo | PDF / 499 Kb |
| Idioma del documento | Inglés |
ADXL1005. Data Sheet. OUTLINE DIMENSIONS. DETAIL A. (JEDEC 95). 5.10. 0.30. 5.00 SQ. 0.25. PIN 1. 4.90. 0.20. INDICATOR
Línea de modelo para esta hoja de datos
Versión de texto del documento
ADXL1005 Data Sheet OUTLINE DIMENSIONS DETAIL A (JEDEC 95) 5.10 0.30 5.00 SQ 0.25 PIN 1 4.90 0.20 PIN 1 INDICATOR INDIC ATOR AREA OPTIONS (SEE DETAIL A) 25 32 24 1 0.50 BSC EXPOSED 3.80 PAD 3.70 SQ 3.60 8 17 16 9 0.45 TOP VIEW BOTTOM VIEW 0.20 MIN 0.40 0.35 3.50 REF *1.85 1.80 0.05 MAX FOR PROPER CONNECTION OF 1.75 THE EXPOSED PAD, REFER TO 0.02 NOM THE PIN CONFIGURATION AND COPLANARITY FUNCTION DESCRIPTIONS SEATING 0.08 SECTION OF THIS DATA SHEET. PLANE 0.203 REF -A 29 2017 048 * -0 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4 G -02- K P WITH EXCEPTION TO PACKAGE HEIGHT. 02
Figure 26. 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 1.8 mm Package Height (CP-32-26) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range g Range Package Description Package Option
ADXL1005BCPZ −40°C to +125°C ±100 g 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-26 ADXL1005BCPZ-RL −40°C to +125°C ±100 g 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-26 ADXL1005BCPZ-RL7 −40°C to +125°C ±100 g 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-26 EVAL-ADXL1005Z ADXL1005 Evaluation Board 1 Z = RoHS Compliant Part.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16589-0-4/18(0)
Rev. 0 | Page 14 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE RECOMMENDED SOLDERING PROFILE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION MECHANICAL DEVICE OPERATION OPERATING MODES Measure Mode Standby Mode BANDWIDTH APPLICATIONS INFORMATION APPLICATION CIRCUIT ON DEMAND SELF TEST RATIOMETRIC OUTPUT VOLTAGE INTERFACING ANALOG OUTPUT BELOW 10 kHz INTERFACING ANALOG OUTPUT BEYOND 10 kHz OVERRANGE MECHANICAL CONSIDERATIONS FOR MOUNTING LAYOUT AND DESIGN RECOMMENDATIONS OUTLINE DIMENSIONS ORDERING GUIDE
Figure 26. 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 1.8 mm Package Height (CP-32-26) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range g Range Package Description Package Option
ADXL1005BCPZ −40°C to +125°C ±100 g 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-26 ADXL1005BCPZ-RL −40°C to +125°C ±100 g 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-26 ADXL1005BCPZ-RL7 −40°C to +125°C ±100 g 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-26 EVAL-ADXL1005Z ADXL1005 Evaluation Board 1 Z = RoHS Compliant Part.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16589-0-4/18(0)
Rev. 0 | Page 14 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE RECOMMENDED SOLDERING PROFILE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION MECHANICAL DEVICE OPERATION OPERATING MODES Measure Mode Standby Mode BANDWIDTH APPLICATIONS INFORMATION APPLICATION CIRCUIT ON DEMAND SELF TEST RATIOMETRIC OUTPUT VOLTAGE INTERFACING ANALOG OUTPUT BELOW 10 kHz INTERFACING ANALOG OUTPUT BEYOND 10 kHz OVERRANGE MECHANICAL CONSIDERATIONS FOR MOUNTING LAYOUT AND DESIGN RECOMMENDATIONS OUTLINE DIMENSIONS ORDERING GUIDE