AP22913Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) SymbolParameterRatingsUnit ESD HBM Human Body Model ESD Protection 6 kV ESD CDM Charged Device Model ESD Protection 2 kV VIN
Input Voltage -0.3 to 6 V VOUT
Output Voltage -0.3 to 6 V VON
ON Voltage -0.3 to 6 V
ILOAD
Maximum Continuous Load Current 2 A T ILOAD
Maximum Pulse Load Current, Pulse <300µs, 2% Duty Cycle 2.5 A C TJ
Maximum Junction Temperature +125 °C U T D ST
Storage Temperature Range -65 to +150 °C O X1-WLB0909-4 930 mW P R D
Power Dissipation SOT26 760 mW P X1-WLB0909-4 136 °C/W RθJA Thermal Resistance, Junction to Ambient (Note 4) W SOT26 165 °C/W E X1-WLB0909-4 31 °C/W N RθJC Thermal Resistance, Junction to Case (Note 5) SOT26 30 °C/W Notes: 4. The JEDEC high-K (2s2p) board used to derive this data was a 3 inch x 3 inch, multilayer board with 1oz internal power and ground planes with 2oz copper traces on top and bottom of the board. 5. Thermal resistance from junction to case. Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, can cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability can be affected by exposure to absolute maximum rating conditions for extended periods of time. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) SymbolParameterMinMaxUnit VIN Input Voltage 1.4 5.5 V VON ON Voltage Range 0 5.5 V VOUT Output Voltage 1.4 5.5 V IOUT Output Current 0 2.0 A VIH ON High-Level Input Voltage 1.1 5.5 V ON Low-Level Input VIN = 3.6V to 5.5V 0 0.6 V VIL Voltage VIN = 1.4V to 3.6V 0 0.4 V TA Operating Ambient Temperature -40 +85 °C