Datasheet BC817DPN (Nexperia) - 6

Nexperia BC817DPN NPN/PNP general purpose transistor 13. Soldering
3.45 1.95 0.45 0.55 solder lands 0.95 (6×) (6×) 3.3 2.825 solder resist 0.95 solder paste occupied area 0.7 Dimensions in mm (6×) 0.8 (6×) 2.4 sot457_fr
Fig. 10. Reflow soldering footprint for SC-74; TSOP6 (SOT457)
5.3 1.5 (4×) solder lands 1.475 solder resist 5.05 0.45 (2×) occupied area 1.475 Dimensions in mm preferred transport direction during soldering 1.45 (6×) 2.85 sot457_fw
Fig. 11. Wave soldering footprint for SC-74; TSOP6 (SOT457)
BC817DPN All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. Al rights reserved
Product data sheet 27 November 2019 6 / 9
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents