Datasheet ADT7517-KGD (Analog Devices) - 11
| Fabricante | Analog Devices |
| Descripción | SPI-/I2C-Compatible, Temperature Sensor, 4-Channel ADC and Quad Voltage Output |
| Páginas / Página | 11 / 11 — Known Good Die. ADT7517-KGD. OUTLINE DIMENSIONS. 0.356. 1.825. 18 17. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 243 Kb |
| Idioma del documento | Inglés |
Known Good Die. ADT7517-KGD. OUTLINE DIMENSIONS. 0.356. 1.825. 18 17. 2.530. TOP VIEW. SIDE VIEW. (CIRCUIT SIDE). 12-. -20. 0.076 × 0.076
Línea de modelo para esta hoja de datos
Versión de texto del documento
Known Good Die ADT7517-KGD OUTLINE DIMENSIONS 0.356 1.825 19 18 17 16 15 1 2 3 4 2.530 5 6 14 7 13 12 8 11 9 10 A TOP VIEW SIDE VIEW (CIRCUIT SIDE) 12- -20 0.076 × 0.076 18 4- 0
Figure 7. 19-Pad Bare Die [CHIP] (C-19-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Chip Size 1707 × 2362 μm Scribe Line Width 118 × 168 μm Die Size 1825 × 2530 μm Thickness 356 μm Bond Pad 76 μm (minimum) Bond Pad Composition 99.5% Al, 0.5% Cu % Backside Not applicable Not applicable Passivation Nitride Not applicable
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach No special requirements Bonding Method Gold ball or aluminum wedge Bonding Sequence Pad 3, Pad 4, and Pad 5 first
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADT7517-KGD-DF −40°C to +120°C 19-Pad Bare Die [CHIP] C-19-1 I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2013–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10686-0-10/14(A)
Rev. A | Page 11 of 11 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DAC AC CHARACTERISTICS TIMING DIAGRAMS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 7. 19-Pad Bare Die [CHIP] (C-19-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Chip Size 1707 × 2362 μm Scribe Line Width 118 × 168 μm Die Size 1825 × 2530 μm Thickness 356 μm Bond Pad 76 μm (minimum) Bond Pad Composition 99.5% Al, 0.5% Cu % Backside Not applicable Not applicable Passivation Nitride Not applicable
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach No special requirements Bonding Method Gold ball or aluminum wedge Bonding Sequence Pad 3, Pad 4, and Pad 5 first
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADT7517-KGD-DF −40°C to +120°C 19-Pad Bare Die [CHIP] C-19-1 I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2013–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10686-0-10/14(A)
Rev. A | Page 11 of 11 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DAC AC CHARACTERISTICS TIMING DIAGRAMS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE