Datasheet LTC6991 (Analog Devices) - 21

FabricanteAnalog Devices
DescripciónTimerBlox: Resettable, Low Frequency Oscillator
Páginas / Página24 / 21 — PACKAGE DESCRIPTION. DCB Package. 6-Lead Plastic DFN (2mm. 3mm)
RevisiónD
Formato / tamaño de archivoPDF / 671 Kb
Idioma del documentoInglés

PACKAGE DESCRIPTION. DCB Package. 6-Lead Plastic DFN (2mm. 3mm)

PACKAGE DESCRIPTION DCB Package 6-Lead Plastic DFN (2mm 3mm)

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LTC6991
PACKAGE DESCRIPTION DCB Package 6-Lead Plastic DFN (2mm
×
3mm)
(Reference LTC DWG # 05-08-1715 Rev A) 0.70 ±0.05 1.65 ±0.05 3.55 ±0.05 (2 SIDES) 2.15 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 1.35 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 2.00 ±0.10 R = 0.115 0.40 ±0.10 (2 SIDES) TYP R = 0.05 4 6 TYP 3.00 ±0.10 1.65 ±0.10 (2 SIDES) (2 SIDES) PIN 1 BAR PIN 1 NOTCH TOP MARK R0.20 OR 0.25 (SEE NOTE 6) × 45° CHAMFER 3 1 (DCB6) DFN 0405 0.25 ±0.05 0.200 REF 0.75 ±0.05 0.50 BSC 1.35 ±0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE Rev. D For more information www.analog.com 21 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts