Datasheet LTM4691 (Analog Devices) - 21
| Fabricante | Analog Devices |
| Descripción | Low VIN, High Efficiency, Dual 2A Step-Down DC/DC µModule Regulator |
| Páginas / Página | 22 / 21 — PACKAGE DESCRIPTION. LGA Package. 24-Lead (3mm. 4mm. 1.18mm). DIMENSIONS. … |
| Formato / tamaño de archivo | PDF / 1.2 Mb |
| Idioma del documento | Inglés |
PACKAGE DESCRIPTION. LGA Package. 24-Lead (3mm. 4mm. 1.18mm). DIMENSIONS. SYMBOL. MIN. NOM. MAX. NOTES
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LTM4691
PACKAGE DESCRIPTION LGA Package 24-Lead (3mm
×
4mm
×
1.18mm)
(Reference LTC DWG# 05-08-1657 Rev A) DETAIL A SEE NOTES Z 6 ccc Z Z A SEE NOTES 4 3 2 1 2× aaa Z A1 3 PIN 1 A PIN 1 CORNER b B 4 b MOLD C CAP D F SUBSTRATE D H1 H2 E e DETAIL B F // bbb Z X e Øb (24 PLACES) E Y b ddd M Z X Y DETAIL B G PACKAGE TOP VIEW aaa Z eee M Z PACKAGE SIDE VIEW PACKAGE BOTTOM VIEW 2× NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS P 3 AD DESIGNATION PER JEP95 DETAIL A 4 DETAILS OF PIN 1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN 1 IDENTIFIER MAY BE EITHER A MOLD OR
DIMENSIONS
MARKED FEATURE
SYMBOL MIN NOM MAX NOTES
0.000 A 1.08 1.18 1.28 5. PRIMARY DATUM -Z- IS SEATING PLANE 0.975 0.325 0.325 0.975 A1 0.03 6 PACKAGE ROW AND COLUMN LABELING MAY VARY b 0.32 0.35 0.38 PAD DIMENSION
!
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE 0.35 REF Ø 24x 1.625 D 4.00 LAYOUT CAREFULLY 0.975 E 3.00 0.325 e 0.65 0.000 F 3.25 0.325 G 1.95 0.975 H1 0.18 REF SUBSTRATE THK H2 1.00 REF MOLD CAP HT LTXXXXXX 1.625 aaa 0.15 COMPONENT bbb 0.10 PIN 1 SUGGESTED PCB LAYOUT ccc 0.10 TOP VIEW ddd 0.15 TRAY PIN 1 eee 0.08 BEVEL TOTAL NUMBER OF PADS: 24 PACKAGE IN TRAY LOADING ORIENTATION LGA 24 0319 REV A Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications For more information www.a subject to change without notice. No license is granted by implication or other nalog.com wise under any patent or patent rights of Analog Devices. 21 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information VIN to VOUT Step-Down Ratios Output Voltage Programming Input Decoupling Capacitors Output Decoupling Capacitors Mode Selection Operating Frequency and External Synchronization Power GOOD Output Overvoltage Protection Output Voltage Soft-Start Dropout Operation Output Short-Circuit Protection and Recovery Load Sharing Using the Precision RUN Threshold Thermal Considerations and Output Current Derating Safety Considerations Layout Checklist/Example Applications Information Typical Applications Pin Configuration Table LTM4691 Component LGA Pinout Package Description Package Photo Related Parts
PACKAGE DESCRIPTION LGA Package 24-Lead (3mm
×
4mm
×
1.18mm)
(Reference LTC DWG# 05-08-1657 Rev A) DETAIL A SEE NOTES Z 6 ccc Z Z A SEE NOTES 4 3 2 1 2× aaa Z A1 3 PIN 1 A PIN 1 CORNER b B 4 b MOLD C CAP D F SUBSTRATE D H1 H2 E e DETAIL B F // bbb Z X e Øb (24 PLACES) E Y b ddd M Z X Y DETAIL B G PACKAGE TOP VIEW aaa Z eee M Z PACKAGE SIDE VIEW PACKAGE BOTTOM VIEW 2× NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS P 3 AD DESIGNATION PER JEP95 DETAIL A 4 DETAILS OF PIN 1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN 1 IDENTIFIER MAY BE EITHER A MOLD OR
DIMENSIONS
MARKED FEATURE
SYMBOL MIN NOM MAX NOTES
0.000 A 1.08 1.18 1.28 5. PRIMARY DATUM -Z- IS SEATING PLANE 0.975 0.325 0.325 0.975 A1 0.03 6 PACKAGE ROW AND COLUMN LABELING MAY VARY b 0.32 0.35 0.38 PAD DIMENSION
!
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE 0.35 REF Ø 24x 1.625 D 4.00 LAYOUT CAREFULLY 0.975 E 3.00 0.325 e 0.65 0.000 F 3.25 0.325 G 1.95 0.975 H1 0.18 REF SUBSTRATE THK H2 1.00 REF MOLD CAP HT LTXXXXXX 1.625 aaa 0.15 COMPONENT bbb 0.10 PIN 1 SUGGESTED PCB LAYOUT ccc 0.10 TOP VIEW ddd 0.15 TRAY PIN 1 eee 0.08 BEVEL TOTAL NUMBER OF PADS: 24 PACKAGE IN TRAY LOADING ORIENTATION LGA 24 0319 REV A Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications For more information www.a subject to change without notice. No license is granted by implication or other nalog.com wise under any patent or patent rights of Analog Devices. 21 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information VIN to VOUT Step-Down Ratios Output Voltage Programming Input Decoupling Capacitors Output Decoupling Capacitors Mode Selection Operating Frequency and External Synchronization Power GOOD Output Overvoltage Protection Output Voltage Soft-Start Dropout Operation Output Short-Circuit Protection and Recovery Load Sharing Using the Precision RUN Threshold Thermal Considerations and Output Current Derating Safety Considerations Layout Checklist/Example Applications Information Typical Applications Pin Configuration Table LTM4691 Component LGA Pinout Package Description Package Photo Related Parts