Datasheet ADA4530-1 (Analog Devices) - 10

ADA4530-1 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 4.
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a Supply Voltage 17 V stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational Input Voltage (V−) − 0.3 V to (V+) + 0.3 V section of this specification is not implied. Operation beyond Input Current1 10 mA the maximum operating conditions for extended periods may Differential Input Voltage ±0.7 V affect product reliability. Output Short-Circuit Duration to GND Indefinite Storage Temperature Range −65°C to +150°C
THERMAL RESISTANCE
Operating Temperature Range −40°C to +125°C θJA is specified for the worst case conditions, that is, a device Junction Temperature Range −65°C to +150°C soldered in a circuit board for surface-mount packages using a Lead Temperature (Soldering, 60 sec) 300°C standard 4-layer JEDEC board. Electrostatic Discharge (ESD) Human Body Model2 4 kV
Table 5. Thermal Resistance
Field Induced Charged Device 1.25 kV
Package Type θJA θJC Unit
Model (FICDM)3 8-Lead SOIC 122 41 °C/W 1 The input pins have clamp diodes to the power supply pins. Limit the input current to 10 mA or less whenever input signals exceed the power supply
ESD CAUTION
rail by 0.3 V. 2 Applicable Standard ESDA/JEDEC JS-001-2012. 3 Applicable Standard JESD22-C101-E (ESD FICDM standard of JEDEC). Rev. B | Page 10 of 52 Document Outline FEATURES APPLICATIONS PIN CONNECTION DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 5 V NOMINAL ELECTRICAL CHARACTERISTICS 10 V NOMINAL ELECTRICAL CHARACTERISTICS 15 V NOMINAL ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS MAIN AMPLIFIER, DC PERFORMANCE MAIN AMPLIFIER, AC PERFORMANCE GUARD AMPLIFIER THEORY OF OPERATION ESD STRUCTURE INPUT STAGE GAIN STAGE OUTPUT STAGE GUARD BUFFER APPLICATIONS INFORMATION INPUT PROTECTION SINGLE-SUPPLY AND RAIL-TO-RAIL OUTPUT CAPACITIVE LOAD STABILITY EMI REJECTION RATIO HIGH IMPEDANCE MEASUREMENTS INPUT BIAS CURRENT INPUT RESISTANCE INPUT OFFSET VOLTAGE INSULATION RESISTANCE GUARDING DIELECTRIC RELAXATION HUMIDITY EFFECTS CONTAMINATION CLEANING AND HANDLING SOLDER PASTE SELECTION CURRENT NOISE CONSIDERATIONS LAYOUT GUIDELINES PHYSICAL IMPLEMENTATION OF GUARDING TECHNIQUES GUARD RING GUARD PLANE VIA FENCE CABLES AND CONNECTORS ELECTROSTATIC INTERFERANCE PHOTODIODE INTERFACE DC ERROR ANALYSIS AC ERROR ANALYSIS NOISE ANALYSIS DESIGN RECOMMENDATIONS DESIGN EXAMPLE POWER SUPPLY RECOMMENDATIONS POWER SUPPLY CONSIDERATIONS LONG-TERM DRIFT TEMPERATURE HYSTERESIS OUTLINE DIMENSIONS ORDERING GUIDE