Datasheet OP220 (Analog Devices) - 10

FabricanteAnalog Devices
DescripciónDual Micropower Operational Amplifier - Obsolete
Páginas / Página12 / 10 — OP220. OUTLINE DIMENSIONS. 8-Lead Ceramic DIP – Glass Hermatic Seal …
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OP220. OUTLINE DIMENSIONS. 8-Lead Ceramic DIP – Glass Hermatic Seal [CERDIP]. 8-Lead Standard Small Outline Package [SOIC]

OP220 OUTLINE DIMENSIONS 8-Lead Ceramic DIP – Glass Hermatic Seal [CERDIP] 8-Lead Standard Small Outline Package [SOIC]

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OP220 OUTLINE DIMENSIONS 8-Lead Ceramic DIP – Glass Hermatic Seal [CERDIP] 8-Lead Standard Small Outline Package [SOIC] (Q-8) Narrow Body
Dimensions shown in inches and (millimeters)
(RN-8)
Dimensions shown in millimeters and (inches)
0.005 (0.13) 0.055 (1.40) MIN MAX 5.00 (0.1968) 4.80 (0.1890) 8 5 0.310 (7.87) 8 5 4.00 (0.1574) 6.20 (0.2440) PIN 1 0.220 (5.59) 3.80 (0.1497) 1 4 5.80 (0.2284) 1 4 0.100 (2.54) BSC 0.320 (8.13) 0.405 (10.29) MAX 1.27 (0.0500) 0.50 (0.0196) 1.75 (0.0688)

45

0.290 (7.37) BSC 0.25 (0.0099) 0.060 (1.52) 1.35 (0.0532) 0.25 (0.0098) 0.200 (5.08) 0.015 (0.38) MAX 0.10 (0.0040) 8 0.51 (0.0201)

0.200 (5.08) 0.150 (3.81) 0 COPLANARITY

1.27 (0.0500) MIN 0.33 (0.0130) 0.25 (0.0098) 0.125 (3.18) SEATING 0.10 0.19 (0.0075) 0.41 (0.0160) PLANE 0.015 (0.38) 0.023 (0.58) SEATING 0.070 (1.78) 15 PLANE 0.008 (0.20) 0.014 (0.36) 0 COMPLIANT TO JEDEC STANDARDS MS-012AA 0.030 (0.76) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR CONTROLLING DIMENSIONS ARE IN INCH; MILLIMETERS DIMENSIONS REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 8-Lead Plastic Dual-in-Line Package [PDIP] 8-Lead Metal Can [TO-99] (N-8) (H-08)
Dimensions shown in inches and (millimeters) Dimensions shown in inches and (millimeters)
0.375 (9.53) REFERENCE PLANE 0.365 (9.27) 0.5000 (12.70) 0.355 (9.02) MIN 0.1850 (4.70) 0.2500 (6.35) MIN 8 5 0.1650 (4.19) 0.295 (7.49) 0.1000 (2.54) BSC 0.0500 (1.27) MAX 0.1600 (4.06) 0.285 (7.24) 0.1400 (3.56) 1 4 0.275 (6.98) 5 0.325 (8.26) 6 4 0.310 (7.87) 0.0450 (1.14) 0.100 (2.54) 0.2000 0.300 (7.62) 0.150 (3.81) 0.0270 (0.69) BSC (5.08) 3 7 0.135 (3.43) BSC 0.015 0.120 (3.05) 0.180 0.3700 (9.40) 0.3350 (8.51) 0.3350 (8.51) 0.3050 (7.75) 2 8 (0.38) (4.57) 1 MAX MIN 0.0190 (0.48) 0.1000 (2.54) 0.015 (0.38) 0.0160 (0.41) BSC 0.0340 (0.86) 0.150 (3.81) 0.0400 (1.02) MAX SEATING 0.010 (0.25) 0.0210 (0.53) 0.0280 (0.71) 0.130 (3.30) PLANE 0.008 (0.20) 0.0400 (1.02) 0.0160 (0.41) 0.110 (2.79) 0.060 (1.52) 0.0100 (0.25) 45 BSC 0.022 (0.56) BASE & SEATING PLANE 0.050 (1.27) 0.018 (0.46) 0.045 (1.14) COMPLIANT TO JEDEC STANDARDS MO-002AK 0.014 (0.36) OBSOLETE CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF EQUIVALENTS FOR COMPLIANT TO JEDEC STANDARDS MO-095AA REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES)
–10– REV. A Document Outline FEATURES GENERAL DESCRIPTION PIN CONFIGURATIONS SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS DIE CHARACTERISTICS ORDERING GUIDE WAFER TEST LIMITS Typical Performance Characteristics INSTRUMENTATION AMPLIFIER APPLICATIONS OF THE OP220 Two Op Amp Configuration THREE OP AMP CONFIGURATION OUTLINE DIMENSIONS Revision History