Datasheet LTM4668A (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | Quad DC/DC µModule Regulator with Configurable 1.2A Output Array |
| Páginas / Página | 24 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 1.2 Mb |
| Idioma del documento | Inglés |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
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LTM4668A
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VIN ... –0.3V to 17V FB2 PGOOD3 VOUT (per Channel) .. –0.3V to 6V FB3 VOUT2 RUN (per Channel) ... –0.3V to 17V 7 VOUT3 PGOOD2 PGOOD (per Channel) .. –0.3V to 6V GND 6 GND FB (per Channel) ...–0.3V to INTVCC RUN2 RUN3 MODE/SYNC ..–0.3V to INTV 5 CC+0.3V MODE/SYNC Operating Junction Temperature (Note 2) .. –40 to 125°C VIN 4 VIN Storage Temperature Range .. –55 to 125°C INTVCC RUN4 3 Peak Solder Reflow Body Temperature ...260°C RUN1 PGOOD1 2 PGOOD4 1 VOUT4 VOUT1 FB1 FB4 A B C D E F G BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 2.1mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCtop = 2.75°C/W, θJB + θBA = 17°C/W, θJA = 10°C/W Weight = 0.79g θ VALUES DETERMINED PER JESD51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4668AEY#PBF LTM4668AY SAC305 (RoHS) e1 BGA 4 –40°C to 125°C LTM4668AIY#PBF LTM4668AY • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing • BGA Package and Tray Drawings Procedures. Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photo Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VIN ... –0.3V to 17V FB2 PGOOD3 VOUT (per Channel) .. –0.3V to 6V FB3 VOUT2 RUN (per Channel) ... –0.3V to 17V 7 VOUT3 PGOOD2 PGOOD (per Channel) .. –0.3V to 6V GND 6 GND FB (per Channel) ...–0.3V to INTVCC RUN2 RUN3 MODE/SYNC ..–0.3V to INTV 5 CC+0.3V MODE/SYNC Operating Junction Temperature (Note 2) .. –40 to 125°C VIN 4 VIN Storage Temperature Range .. –55 to 125°C INTVCC RUN4 3 Peak Solder Reflow Body Temperature ...260°C RUN1 PGOOD1 2 PGOOD4 1 VOUT4 VOUT1 FB1 FB4 A B C D E F G BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 2.1mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCtop = 2.75°C/W, θJB + θBA = 17°C/W, θJA = 10°C/W Weight = 0.79g θ VALUES DETERMINED PER JESD51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4668AEY#PBF LTM4668AY SAC305 (RoHS) e1 BGA 4 –40°C to 125°C LTM4668AIY#PBF LTM4668AY • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing • BGA Package and Tray Drawings Procedures. Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photo Design Resources Related Parts