Datasheet CV94D-FCC (Cree) - 9
| Fabricante | Cree |
| Descripción | PLCC6 3 in 1 SMD LED |
| Páginas / Página | 11 / 9 — Cree PLCC6 3 in 1 SMD LED. CV94D-FCC. REFLOW SOLDERING. Use all SMD … |
| Formato / tamaño de archivo | PDF / 1.2 Mb |
| Idioma del documento | Inglés |
Cree PLCC6 3 in 1 SMD LED. CV94D-FCC. REFLOW SOLDERING. Use all SMD besides LP6-NPP1-01-N1. Solder = Sn63-Pb37
Línea de modelo para esta hoja de datos
Versión de texto del documento
Cree PLCC6 3 in 1 SMD LED CV94D-FCC REFLOW SOLDERING
• The CV94D-FCC is rated as a MSL 5a product. • The recommended floor life out of bag is 24hrs. • The temperature profile is as below. Document No.: COTCO-05-0057 Rev. NO. : 13 Melting-point perature Tem Pre-heat Soak Reflow Cooling Time
Use all SMD besides LP6-NPP1-01-N1
Use only with CV94D-FCC
Solder = Sn63-Pb37 Solder = Lead-free Solder
Average ramp-up rate = 4ºC/s max. Average ramp-up rate = 4ºC/s max Average ramp-up rate = 4ºC/s max Preheat temper Preheat ature = 150ºC ~200ºC temperature = 100ºC ~150ºC Preheat temperature = 150ºC ~200ºC Preheat time = 120s max Preheat time = 100s max. Preheat time = 100s max. Ramp-down r Ramp-ate = 6ºC/s max down rate = 6ºC/s max. Ramp-down rate = 6ºC/s max. Peak temperature = 235ºC max Peak temperature = 230ºC max. Peak temperature = 250ºC max. Time within 5ºC of actual Peak Temperature = 10s max Time within 5ºC of actual Peak Temperature = 10s max. Time within 5ºC of actual Peak Temperature = 10s max. Duration above 217ºC is 45s max Duration above 183ºC is 80s max. Duration above 217ºC is 80s max.
Only use LP6-NPP1-01-N1 [13] Solder = Low Lead-free
Average ramp-up rate = 3ºC/s max. Preheat temperature = 130ºC ~170ºC Preheat time = 120s max. Ramp-down rate = 6ºC/s max. Peak temperature = 213ºC max. Time within 3ºC of actual Peak Temperature = 25s max. Duration above 200ºC is 40s max. Recommended solder pad design for heat dissipation (2-pin SMD LED): Refer to "http://www.cree.com/led-components/media/documents/sh-HB.pdf" for soldering & handling details. 7.0 Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Copyright © 2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. 2.6 9 7.5 4.5 0.5 1.5 Recommended solder pad design for heat dissipation (4-pin SMD LED) 6/9
• The CV94D-FCC is rated as a MSL 5a product. • The recommended floor life out of bag is 24hrs. • The temperature profile is as below. Document No.: COTCO-05-0057 Rev. NO. : 13 Melting-point perature Tem Pre-heat Soak Reflow Cooling Time
Use all SMD besides LP6-NPP1-01-N1
Use only with CV94D-FCC
Solder = Sn63-Pb37 Solder = Lead-free Solder
Average ramp-up rate = 4ºC/s max. Average ramp-up rate = 4ºC/s max Average ramp-up rate = 4ºC/s max Preheat temper Preheat ature = 150ºC ~200ºC temperature = 100ºC ~150ºC Preheat temperature = 150ºC ~200ºC Preheat time = 120s max Preheat time = 100s max. Preheat time = 100s max. Ramp-down r Ramp-ate = 6ºC/s max down rate = 6ºC/s max. Ramp-down rate = 6ºC/s max. Peak temperature = 235ºC max Peak temperature = 230ºC max. Peak temperature = 250ºC max. Time within 5ºC of actual Peak Temperature = 10s max Time within 5ºC of actual Peak Temperature = 10s max. Time within 5ºC of actual Peak Temperature = 10s max. Duration above 217ºC is 45s max Duration above 183ºC is 80s max. Duration above 217ºC is 80s max.
Only use LP6-NPP1-01-N1 [13] Solder = Low Lead-free
Average ramp-up rate = 3ºC/s max. Preheat temperature = 130ºC ~170ºC Preheat time = 120s max. Ramp-down rate = 6ºC/s max. Peak temperature = 213ºC max. Time within 3ºC of actual Peak Temperature = 25s max. Duration above 200ºC is 40s max. Recommended solder pad design for heat dissipation (2-pin SMD LED): Refer to "http://www.cree.com/led-components/media/documents/sh-HB.pdf" for soldering & handling details. 7.0 Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Copyright © 2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. 2.6 9 7.5 4.5 0.5 1.5 Recommended solder pad design for heat dissipation (4-pin SMD LED) 6/9