Preliminary Datasheet BM77SPPx3MC2 (Microchip) - 2

FabricanteMicrochip
DescripciónBluetooth 4.0 Dual Mode Module
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BM77SPPx3MC2

BM77SPPx3MC2

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BM77SPPx3MC2
1.0 DEVICE OVERVIEW The BM77 is a complete, fully certified, embedded 2.4 GHz Bluetooth® version 4.0 (BR/EDR/LE) wireless
module. It incorporates an on-board Bluetooth stack, cryptographic accelerator, power management
subsystem, 2.4 GHz transceiver, and RF power amplifier (see Figure 1-1). With the BM77, designers can
embed Bluetooth functionality rapidly into virtually any device.
The BM77 provides cost and time-to-market savings as a self-contained module solution. The module
has been designed to provide integrators with a simple Bluetooth solution that features:
• Ease of integration and programming
• Vastly reduced development time
• Minimum system cost
• Interoperability with Bluetooth hosts
• Maximum value in a range of applications
The BM77 can independently maintain a low-power wireless connection. Low-power usage and flexible
power management maximize the module’s lifetime in battery-operated devices.
The BM77 module comes in two varieties. The BM77SPPS3MC2 is a complete, fully regulatory certified
module with integral ceramic chip antenna and shield. The BM77SPP03MC2 is a lower cost alternative
with external antenna and no shield. The integrator is responsible for the antenna, antenna matching,
and regulatory certifications.
The BM77 is a small, compact, surface mount module with castellated pads for easy and reliable host
PCB mounting. The module is compatible with standard pick-and-place equipment. TABLE 1-1: BM77 MODULE FAMILY TYPES
Device
BM77SPPS3MC2-0007AA
BM77SPP03MC2-0007AA Antenna
Integral ceramic chip
External Shield
Yes
No Regulatory Certifications
FCC, IC, CE, KCC, NCC, Japan
CE FIGURE 1-1: BM77 BLOCK DIAGRAM
BM77SPPx3MC2
Ceramic Chip Antenna
(BM77SPPS3MC2) External Antenna
(BM77SPP03MC2) IS1677SM 16 MHz RF Matching Configurable
Control and
Indication I/O UART Power I2C
8Kbit
Serial
EEPROM 1.1 Interface Description © 2014 ISSC Technologies Corp. Preliminary Revision 2.1.1 – June 16, 2015 Page 2