Datasheet BLF989E, BLF989ES (Ampleon) - 5

FabricanteAmpleon
DescripciónUHF power LDMOS transistor
Páginas / Página12 / 5 — BLF989E; BLF989ES. UHF power LDMOS transistor. 7.2 Test circuit. Fig 1. …
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BLF989E; BLF989ES. UHF power LDMOS transistor. 7.2 Test circuit. Fig 1. Component layout for production RF test circuit. Table 9

BLF989E; BLF989ES UHF power LDMOS transistor 7.2 Test circuit Fig 1 Component layout for production RF test circuit Table 9

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BLF989E; BLF989ES UHF power LDMOS transistor 7.2 Test circuit
95 mm + - 95 mm C12 R2 C9 C2 L22 C37 L2 C10 C36 R21 C31 C29 C27 R28 R27 C33 80 mm C26 C32 C5 C25 R26 C24 R24 C13 R25 C30 C28 R20 C3 C35 C1 C34 L21 C8 L1 C7 R1 amp01280 - + C11 Printed-Circuit Board (PCB): Rogers RO3006; r = 6.5 F/M; height = 0.635 mm; Cu (top/bottom metallization); thickness copper plating = 29.6 m; Rogers RO3010; r = 10 F/M; height = 0.254 mm. See Table 9 for a list of components.
Fig 1. Component layout for production RF test circuit Table 9. List of components
See Figure 1 for component layout.
Component Description Value Remarks
C1, C2, C7, C9, C13 multilayer ceramic chip capacitor 100 pF [1] ATC 800B C3 multilayer ceramic chip capacitor 10 pF [1] ATC 800B C5 multilayer ceramic chip capacitor 8.2 pF [1] ATC 800B C8, C10 multilayer ceramic chip capacitor 4.7 F, 100 V TDK C11, C12 electrolytic capacitor 470 F, 63 V L1, L2 one turn inductor D = 5 mm, d = 1mm R1 chip resistor 1 SMD 1206 R2 chip resistor 5.6 SMD 1206 C24, C25, C26, C27 multilayer ceramic chip capacitor 20 pF [1] ATC 800B C28, C29 multilayer ceramic chip capacitor 10 pF [1] ATC 800B C30, C31 multilayer ceramic chip capacitor 5.1 pF [1] ATC 800B C32, C33, C34, C36 multilayer ceramic chip capacitor 100 pF [1] ATC 800B C35, C37 multilayer ceramic chip capacitor 4.7 F, 63 V TDK L21, L22 one turn inductor D = 5 mm, d = 1mm R20, R21 chip resistor 5.6 SMD 0805 R25, R26 chip resistor 300 SMD 1206 BLF989E_BLF989ES All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2020. All rights reserved.
Product data sheet Rev. 1 — 3 April 2020 5 of 12
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Test information 7.1 Ruggedness in Doherty operation 7.2 Test circuit 7.3 Graphs 7.3.1 DVB-T in production test circuit 8. Package outline 9. Handling information 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Licenses 12.5 Trademarks 13. Contact information 14. Contents