Datasheet 1ED34x1Mc12M (1ED-X3 Analog) (Infineon) - 6

FabricanteInfineon
DescripciónEiceDRIVER/ 1ED34x1Mc12M Enhanced. Single-channel isolated gate driver IC with adjustable DESAT and soft-off
Páginas / Página45 / 6 — EiceDRIVER™ 1ED34x1Mc12M Enhanced. Datasheet. 2 Related products. Related …
Revisión02_00
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EiceDRIVER™ 1ED34x1Mc12M Enhanced Datasheet 2 Related products 2 Related products Product group Product name Description
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EconoPACK™ 3 1200 V, 200 A sixpack IGBT module Datasheet 6 v2.0 2020-03-26 Document Outline Table of contents 1 Block diagram 2 Related products 3 Pin configuration and functionality 3.1 Pin configuration 3.2 Pin functionality 4 Functional description 4.1 Start-up and fault clearing 4.2 Supply 4.2.1 Input side undervoltage lockout, VCC1 UVLO 4.2.2 Output side under-voltage lockout, VCC2 UVLO 4.3 Input side logic 4.3.1 IN non-inverting driver input 4.3.2 RDYC ready status output, fault-off and fault clear input 4.3.2.1 RDYC fault-off input 4.3.2.2 RDYC fault clear input 4.3.3 FLT_N status output and fault-off input 4.3.3.1 FLT_N fault-off input 4.4 Desaturation protection 4.4.1 DESAT behavior 4.4.2 DESAT filter and leading edge blanking time adjustment with ADJB 4.5 Gate driver output 4.5.1 Turn-on behavior 4.5.2 Turn-off and fault turn-off behavior 4.5.2.1 Hard switching turn-off 4.5.2.2 Soft turn-off 4.5.2.2.1 Soft-off current source adjustment with ADJA 4.5.3 Active shut-down 4.5.4 Active Miller clamp 4.5.4.1 CLAMP output types 4.5.5 Switch-off timeout until forced switch-off 4.6 Short circuit clamping 5 Electrical parameters 5.1 Absolute maximum ratings 5.2 Thermal parameters 5.3 Operating parameters 5.4 Electrical characteristics 5.4.1 Voltage supply 5.4.2 Logic input and output 5.4.3 Analog input 5.4.4 Gate driver 5.4.5 Active Miller clamp 5.4.6 Dynamic characteristics 5.4.7 Desaturation protection 5.4.8 Soft-off current source 5.4.9 Over-temperature protection 6 Insulation characteristics 6.1 Certified according to VDE 0884-11 and IEC 60747-17 reinforced insulation (planned) 6.2 Recognized under UL 1577 (planned) 6.3 Reliability 7 Package information 8 Application notes 8.1 Reference layout for thermal data 8.2 Printed circuit board guidelines Revision history Disclaimer