Datasheet BAT46WJ (Nexperia) - 3

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Nexperia BAT46WJ Single Schottky barrier diode Table 6. Thermal characteristics
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Symbol Parameter Conditions Min Typ Max Unit
R [4] th(j-sp) thermal resistance from - - 35 K/W junction to solder point [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Reflow soldering is the only recommended soldering method. [4] Soldering point of cathode tab. 006aac385 103 duty cycle = Zth(j-a) (K/W) 1 0.75 0.5 102 0.33 0.25 0.2 0.1 0.05 10 0.02 0.01 0 1 10−5 10−3 10−2 10−4 10 102 10−1 103 1 tp (s) FR4 PCB, standard footprint
Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aac386 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0.02 0.01 0 1 10−5 10−3 10−2 10−4 10 102 10−1 103 1 tp (s) FR4 PCB, mounting pad for cathode 1 cm2
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BAT46WJ All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet Rev. 2 — 8 November 2011 3 of 12
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents