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requirements, norms and standards concerning Document reference customer’s products and any use of the product of IFX-jxp1587992470902 Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. Document Outline Features Potential applications Product validation Description Table of contents 1 Block diagram reference 2 Pin configuration 2.1 Pin definitions and functions 2.2 Pin configuration drawing IMD111T 2.3 Pin configuration drawing IMD112T 3 Functional description 3.1 Overview 3.2 Motion Control Engine 3.3 Gate Driver 3.4 Low Side Supply (VCC, VSS and COM) 3.5 High Side Supplies (VB1,2,3 and VS1,2,3) 3.6 Low and High Side Outputs (LO1,2,3 and HO1,2,3) 3.7 Internal Voltage Regulator 3.8 Application diagrams 4 Electrical characteristics and parameters 4.1 General parameters 4.1.1 Parameter Interpretation 4.1.2 Absolute maximum ratings 4.1.3 Pin Reliability in Overload 4.1.4 Operating Conditions 4.2 DC characteristics 4.2.1 Input/Output Characteristics 4.2.2 Analog to Digital Converter (ADC) 4.2.3 Analog comparator characteristics 4.2.4 Power Supply Current 4.2.5 Flash Memory Parameters 4.2.6 Static parameters gate driver 4.2.7 Static parameters voltage regulator 4.3 AC characteristics 4.3.1 Testing Waveforms 4.3.2 On-Chip Oscillator Characteristics 4.3.3 Dynamic parameters gate driver 4.3.4 Timing diagrams 4.4 Motor Control Parameters 4.4.1 PWM Characteristics 4.4.2 Current Sensing 4.4.3 Fault Timing 4.5 Power Factor Correction (PFC) parameters 4.5.1 Boost PFC characteristics 4.5.2 Totem Pole PFC characteristics 4.5.3 PFC Current Sensing 4.6 Control Interface Parameters 4.6.1 Control Input Interfaces 4.6.2 Serial Interface Parameters 4.6.2.1 UART Interface 4.6.3 Over Temperature Input 4.6.4 Pulse Output 5 Device and package specifications 5.1 Quality declaration 5.2 SBSL and Chip-IDs 5.3 Thermal considerations 5.4 Package Outline PG-LQFP-40-1 5.5 Part marking information Revision history Disclaimer