Datasheet LT8606, LT8606B (Analog Devices) - 21
| Fabricante | Analog Devices |
| Descripción | 42V, 350mA Synchronous Step-Down Regulator with 2.5µA Quiescent Current |
| Páginas / Página | 24 / 21 — PACKAGE DESCRIPTION. MSE Package. 10-Lead Plastic MSOP, Exposed Die Pad. … |
| Revisión | D |
| Formato / tamaño de archivo | PDF / 2.5 Mb |
| Idioma del documento | Inglés |
PACKAGE DESCRIPTION. MSE Package. 10-Lead Plastic MSOP, Exposed Die Pad. NO MEASUREMENT PURPOSE
Línea de modelo para esta hoja de datos
- LT8606BEDC#TRMPBF LT8606BEDC#TRPBF LT8606BHDC#TRMPBF LT8606BHDC#TRPBF LT8606BIDC#TRMPBF LT8606BIDC#TRPBF LT8606EDC#TRMPBF LT8606EDC#TRPBF LT8606EDC#WTRMPBF LT8606EMSE#PBF LT8606EMSE#TRPBF LT8606EMSE#WPBF LT8606EMSE#WTRPBF LT8606HDC#TRMPBF LT8606HDC#TRPBF LT8606HDC#WTRMPBF LT8606HDC#WTRPBF LT8606HMSE#PBF LT8606HMSE#TRPBF LT8606HMSE#WPBF LT8606HMSE#WTRPBF LT8606IDC#TRMPBF LT8606IDC#TRPBF LT8606IDC#WTRMPBF LT8606IDC#WTRPBF LT8606IMSE#PBF LT8606IMSE#TRPBF LT8606IMSE#WPBF LT8606IMSE#WTRPBF LT8606JDC#WTRMPBF LT8606JDC#WTRPBF LT8606JMSE#WPBF LT8606JMSE#WTRPBF
Versión de texto del documento
LT8606/LT8606B
PACKAGE DESCRIPTION MSE Package 10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 ±0.102 1.88 0.889 ±0.127 1 (.074 ±.004) (.074) 0.29 (.035 ±.005) 1.68 REF (.066) 5.10 0.05 REF (.201) 1.68 ±0.102 3.20 – 3.45 DETAIL “B” MIN (.066 ±.004) (.126 – .136) CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. 10 FOR REFERENCE ONLY 0.50
NO MEASUREMENT PURPOSE
0.305 ± 0.038 (.0197) 3.00 ±0.102 (.0120 ±.0015) BSC (.118 ±.004) 0.497 ±0.076 TYP (NOTE 3) (.0196 ±.003) RECOMMENDED SOLDER PAD LAYOUT 10 9 8 7 6 REF 4.90 ±0.152 3.00 ±0.102 (.193 ±.006) (.118 ±.004) (NOTE 4) DETAIL “A” 0.254 (.010) 0° – 6° TYP 1 2 3 4 5 GAUGE PLANE 0.53 ±0.152 1.10 0.86 (.021 ±.006) (.043) (.034) MAX REF DETAIL “A” 0.18 (.007) SEATING PLANE 0.17 – 0.27 0.1016 ±0.0508 (.007 – .011) (.004 ±.002) TYP 0.50 MSOP (MSE) 0213 REV I (.0197) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. Rev. D For more information www.analog.com 21 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
PACKAGE DESCRIPTION MSE Package 10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 ±0.102 1.88 0.889 ±0.127 1 (.074 ±.004) (.074) 0.29 (.035 ±.005) 1.68 REF (.066) 5.10 0.05 REF (.201) 1.68 ±0.102 3.20 – 3.45 DETAIL “B” MIN (.066 ±.004) (.126 – .136) CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. 10 FOR REFERENCE ONLY 0.50
NO MEASUREMENT PURPOSE
0.305 ± 0.038 (.0197) 3.00 ±0.102 (.0120 ±.0015) BSC (.118 ±.004) 0.497 ±0.076 TYP (NOTE 3) (.0196 ±.003) RECOMMENDED SOLDER PAD LAYOUT 10 9 8 7 6 REF 4.90 ±0.152 3.00 ±0.102 (.193 ±.006) (.118 ±.004) (NOTE 4) DETAIL “A” 0.254 (.010) 0° – 6° TYP 1 2 3 4 5 GAUGE PLANE 0.53 ±0.152 1.10 0.86 (.021 ±.006) (.043) (.034) MAX REF DETAIL “A” 0.18 (.007) SEATING PLANE 0.17 – 0.27 0.1016 ±0.0508 (.007 – .011) (.004 ±.002) TYP 0.50 MSOP (MSE) 0213 REV I (.0197) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. Rev. D For more information www.analog.com 21 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts