Datasheet HMC442 (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | GaAs pHEMT MMIC MEDIUM POWER AMPLIFIERS, 17.5 - 25.5 GHz |
| Páginas / Página | 6 / 4 — HMC442. GaAs pHEMT MMIC MEDIUM. POWER AMPLIFIERS, 17.5 - 25.5 GHz. … |
| Formato / tamaño de archivo | PDF / 374 Kb |
| Idioma del documento | Inglés |
HMC442. GaAs pHEMT MMIC MEDIUM. POWER AMPLIFIERS, 17.5 - 25.5 GHz. Absolute Maximum Ratings. Typical Supply Current vs. Vdd
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HMC442
v04.0913
GaAs pHEMT MMIC MEDIUM POWER AMPLIFIERS, 17.5 - 25.5 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +5.5 Vdc Vdd (Vdc) Idd (mA) Gate Bias Voltage (Vgg) -4 to 0 Vdc +4.5 82 RF Input Power (RFIN)(Vdd = +5Vdc) +20 dBm +5.0 85 IP Channel Temperature 175 °C +5.5 89 H Continuous Pdiss (T= 85 °C) +2.7 79 0.64 W (derate 7.1 mW/°C above 85 °C) +3.0 83 Thermal Resistance 141 °C/W +3.3 86 S - C (channel to die bottom) Note: Amplifier will operate over full voltage ranges shown above R Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C IE ELECTROSTATIC SENSITIVE DEVICE LIF OBSERVE HANDLING PRECAUTIONS P M
Outline Drawing
R A E W O R & P A E LIN NOTES:
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” Standard Alternate 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD GP-2 (Gel Pack) [2] 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. [1] Refer to the “Packaging Information” section for die 7. CONNECTION NOT REQUIRED FOR packaging dimensions. UNLABELED BOND PADS. [2] For alternate packaging information contact Hittite Microwave Corporation. Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
4
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D
v04.0913
GaAs pHEMT MMIC MEDIUM POWER AMPLIFIERS, 17.5 - 25.5 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +5.5 Vdc Vdd (Vdc) Idd (mA) Gate Bias Voltage (Vgg) -4 to 0 Vdc +4.5 82 RF Input Power (RFIN)(Vdd = +5Vdc) +20 dBm +5.0 85 IP Channel Temperature 175 °C +5.5 89 H Continuous Pdiss (T= 85 °C) +2.7 79 0.64 W (derate 7.1 mW/°C above 85 °C) +3.0 83 Thermal Resistance 141 °C/W +3.3 86 S - C (channel to die bottom) Note: Amplifier will operate over full voltage ranges shown above R Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C IE ELECTROSTATIC SENSITIVE DEVICE LIF OBSERVE HANDLING PRECAUTIONS P M
Outline Drawing
R A E W O R & P A E LIN NOTES:
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” Standard Alternate 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD GP-2 (Gel Pack) [2] 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. [1] Refer to the “Packaging Information” section for die 7. CONNECTION NOT REQUIRED FOR packaging dimensions. UNLABELED BOND PADS. [2] For alternate packaging information contact Hittite Microwave Corporation. Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
4
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D