Datasheet HMC-AUH312 (Analog Devices) - 10

FabricanteAnalog Devices
Descripción0.5 GHz to 80 GHz, GaAs, HEMT, MMIC, Low Noise Wideband Amplifier
Páginas / Página17 / 10 — HMC-AUH312. Data Sheet. Bc). C (. R HARM. RDE. 0dBm. ND-. 1dBm. 2dBm. …
RevisiónF
Formato / tamaño de archivoPDF / 473 Kb
Idioma del documentoInglés

HMC-AUH312. Data Sheet. Bc). C (. R HARM. RDE. 0dBm. ND-. 1dBm. 2dBm. 3dBm. 4dBm. 5dBm. FREQUENCY (GHz)

HMC-AUH312 Data Sheet Bc) C ( R HARM RDE 0dBm ND- 1dBm 2dBm 3dBm 4dBm 5dBm FREQUENCY (GHz)

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HMC-AUH312 Data Sheet 50 50 Bc) 40 Bc) 40 d d C ( C ( NI NI O O 30 30 R HARM R HARM 20 RDE 20 RDE O O 0dBm ND- ND- 1dBm CO 10 CO 2dBm E 8V 10 E S 3dBm 7V S 4dBm 6V 5dBm 0 0 0 4 8 12 16 20 24
019
0 4 8 12 16 20 24
020
FREQUENCY (GHz)
13476-
FREQUENCY (GHz)
13476- Figure 19. Second-Order Harmonic vs. Frequency at Various Supplies Figure 20. Second-Order Harmonic vs. Frequency at Various POUT Levels (VDD), POUT = 2 dBm Rev. F | Page 10 of 11 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications 0.5 GHz to 60 GHz Frequency Range 60 GHz to 80 GHz Frequency Range Recommended Operating Conditions Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Applications Overview Device Mounting Device Operation Device Power-Up Instructions Device Power-Down Instructions Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Guidelines for ESD Protection of GaAs MMICs Handling Precautions Opening the Protective Packaging Storage Cleanliness Static Sensitivity Transients General Handling Mounting Techniques Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide