Datasheet HMC998APM5E (Analog Devices) - 11

FabricanteAnalog Devices
DescripciónGaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, DC - 22 GHz
Páginas / Página14 / 11 — HMC998APM5E. GaAs pHEMT MMIC. 2 WATT POWER AMPLIFIER, DC - 22 GHz. …
Formato / tamaño de archivoPDF / 1.5 Mb
Idioma del documentoInglés

HMC998APM5E. GaAs pHEMT MMIC. 2 WATT POWER AMPLIFIER, DC - 22 GHz. Absolute Maximum Ratings. Reliability Information

HMC998APM5E GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, DC - 22 GHz Absolute Maximum Ratings Reliability Information

Línea de modelo para esta hoja de datos

Versión de texto del documento

HMC998APM5E
v04.0121
GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, DC - 22 GHz Absolute Maximum Ratings Reliability Information
Drain Bias Voltage (Vdd) +16 Vdc Channel Temperature to main- T 175 °C tain 1 million Hour mTTf Gate Bias Voltage (Vgg1) -3 to 0 Vdc m nominal Channel Temperature Gate Bias Voltage (Vgg2) (Vdd-6V) up to +11.5 Vdc 153.25°C s (T=85 °C, Vdd = 15 V) rf input power (rfin) +27 dBm Thermal resistance 9.1 °C/w Continuous pdiss (T= 85 °C) (channel to ground paddle) r - (derate 109.89 mw/°C above 85 9.9 w e °C) output load Vswr 7:1 w eleCTrosTATiC sensiTiVe DeViCe storage Temperature -65 to 150°C o oBserVe HAnDlinG preCAUTions operating Temperature -40 to 85 °C p esD sensitivity (HBm) Class 1A
Stresses at or above those listed under Absolute Maxi-
max peak reflow Temperature 260 °C
mum Ratings may cause permanent damage to the prod- uct. This is a stress rating only, functional operation of the
r &
product at these or any other conditions above those indi-
A
cated in the operational section of this specification is not
e
implied. Operation beyond the maximum operating condi- tions for extended periods may affect product reliability. 32-Lead Lead Frame Chip Scale Package, Premolded Cavity [LFCSP_CAV] 5 x 5 mm Body and 1.25 mm Package Height
lin
(CG-32-2) Outline Drawing Dimensions shown in millimeters
s -
DETAIL A (JEDEC 95)
r
5.10 0.30 5.00 SQ 0.25
ie
PIN 1 4.90 0.20 INDICATOR PIN 1 25 32 INDICATOR AREA OPTIONS (SEE DETAIL A) 24 1
lif
0.50
p
BSC 3.20 EXPOSED 3.10 SQ PAD
m
3.00
A
17 8 16 9 0.45 TOP VIEW BOTTOM VIEW 0.40 3.50 REF 0.35 1.35 FOR PROPER CONNECTION OF 0.60 REF SIDE VIEW THE EXPOSED PAD, REFER TO 1.25 0.40 THE PIN CONFIGURATION AND 1.15 0.050 MAX FUNCTION DESCRIPTIONS 0.035 NOM SECTION OF THIS DATA SHEET. COPLANARITY SEATING 0.08 PLANE 0.203 REF PKG-005068 04-19-2017-A
32-lead lead frame Chip scale package, premolded Cavity [lfCsp_CAV] 5mm × 5mm and 1.25mm package Height (CG-32-2) Dimensions shown in mil imeters.
Package Information
part number package Body material lead finish msl rating [1] package marking HmC998Apm5e roHs-compliant low stress pre-molded plastic nipdAu msl3 HmC998A [1] max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
11
Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D