Data SheetADPA7001CHIPSSPECIFICATIONS 50 GHz TO 70 GHz FREQUENCY RANGE TDIE BOTTOM = 25°C, VDD = VDD1A = VDD2A = VDD3A = VDD4A = 3.5 V and supply current (IDQ) = IDQ1A + IDQ2A + IDQ3A + IDQ4A = 350 mA, unless otherwise noted. Adjust VGG = VGG12A = VGG34A from −1.5 V to 0 V to achieve the desired IDQ. Typical VGG = −0.5 V for IDQ = 350 mA. Table 1. Parameter SymbolMinTypMaxUnitTestConditions/Comments FREQUENCY RANGE
50 70 GHz
GAIN 12.5 14.5 dB
Gain Variation over Temperature 0.02 dB/°C RETURN LOSS
Input S11 22 dB
Output S22 19 dB
OUTPUT
Output Power for 1 dB Compression P1dB 15.5 17 dBm
Saturated Output Power PSAT 21 dBm
Output Third-Order Intercept OIP3 25.5 dBm Output power (POUT) per tone = 0 dBm with 1 MHz tone spacing
INPUT Input Third-Order Intercept IIP3 11.5 dBm POUT per tone = 0 dBm with 1 MHz tone spacing SUPPLY Current IDQ 350 400 mA Adjust VGG to achieve IDQ = 350 mA typical Voltage VDD 1.5 3.5 4.0 V 70 GHz TO 90 GHz FREQUENCY RANGE TDIE BOTTOM = 25°C, VDD = VDD1A = VDD2A = VDD3A = VDD4A = 3.5 V and IDQ = IDQ1A + IDQ2A + IDQ3A + IDQ4A = 350 mA, unless otherwise noted. Adjust VGG = VGG12A = VGG34A from −1.5 V to 0 V to achieve the desired IDQ. Typical VGG = −0.5 V for IDQ = 350 mA. Table 2. Parameter SymbolMinTypMaxUnitTestConditions/Comments FREQUENCY RANGE
70 90 GHz
GAIN 12 14 dB
Gain Variation over Temperature 0.02 dB/°C
RETURN LOSS
Input S11 18 dB
Output S22 13 dB
OUTPUT
Output Power for 1 dB Compression P1dB 16 17.5 dBm
Saturated Output Power PSAT 21 dBm
Output Third-Order Intercept OIP3 25 dBm POUT per tone = 0 dBm with 1 MHz tone spacing
INPUT Input Third-Order Intercept IIP3 11 dBm POUT per tone = 0 dBm with 1 MHz tone spacing SUPPLY Current IDQ 350 400 mA Adjust VGG to achieve IDQ = 350 mA typical Voltage VDD 1.5 3.5 4.0 V Rev. B | Page 3 of 18 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS 50 GHz TO 70 GHz FREQUENCY RANGE 70 GHz TO 90 GHz FREQUENCY RANGE 90 GHz TO 95 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE