Datasheet HMC8205BCHIPS (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | 0.4 GHz to 6 GHz, 35 W, GaN, Power Amplifier |
| Páginas / Página | 19 / 2 — HMC8205BCHIPS. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 318 Kb |
| Idioma del documento | Inglés |
HMC8205BCHIPS. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 4/2020—Rev. 0 to Rev. A. 11/2018—Revision 0: Initial Version
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HMC8205BCHIPS Data Sheet TABLE OF CONTENTS
Features .. 1 Typical Performance Characteristics ...7 Applications .. 1 Theory of Operation .. 15 Functional Block Diagram .. 1 Applications Information ... 16 General Description ... 1 Recommended Bias Sequencing .. 16 Revision History ... 2 Mounting and Bonding Techniques for Mil imeterwave Specifications .. 3 GaAs MMICs .. 16 Electrical Specifications ... 3 Typical Application Circuit .. 18 Absolute Maximum Ratings ... 5 Assembly Diagram ... 18 Thermal Resistance .. 5 Outline Dimensions ... 19 ESD Caution.. 5 Ordering Guide .. 19 Pin Configuration and Function Description .. 6 Interface Schematics .. 6
REVISION HISTORY 4/2020—Rev. 0 to Rev. A
Updated Outline Dimensions ... 19
11/2018—Revision 0: Initial Version
Rev. A | Page 2 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
HMC8205BCHIPS Data Sheet TABLE OF CONTENTS
Features .. 1 Typical Performance Characteristics ...7 Applications .. 1 Theory of Operation .. 15 Functional Block Diagram .. 1 Applications Information ... 16 General Description ... 1 Recommended Bias Sequencing .. 16 Revision History ... 2 Mounting and Bonding Techniques for Mil imeterwave Specifications .. 3 GaAs MMICs .. 16 Electrical Specifications ... 3 Typical Application Circuit .. 18 Absolute Maximum Ratings ... 5 Assembly Diagram ... 18 Thermal Resistance .. 5 Outline Dimensions ... 19 ESD Caution.. 5 Ordering Guide .. 19 Pin Configuration and Function Description .. 6 Interface Schematics .. 6
REVISION HISTORY 4/2020—Rev. 0 to Rev. A
Updated Outline Dimensions ... 19
11/2018—Revision 0: Initial Version
Rev. A | Page 2 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE