Datasheet HMC1087 (Analog Devices) - 3

FabricanteAnalog Devices
Descripción8 WATT GaN MMIC POWER AMPLIFIER, 2 - 20 GHz
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HMC1087. 8 WATT GaN MMIC POWER AMPLIFIER,. 2 - 20 GHz. Power Gain vs. Frequency. Power Added Efficiency vs. Pin. Pout vs. Pin

HMC1087 8 WATT GaN MMIC POWER AMPLIFIER, 2 - 20 GHz Power Gain vs Frequency Power Added Efficiency vs Pin Pout vs Pin

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HMC1087
v05.1217
8 WATT GaN MMIC POWER AMPLIFIER, 2 - 20 GHz Power Gain vs. Frequency Power Added Efficiency vs. Pin
20 40 18 35 IP 16 H 30 B) 14 (d ) N 12 25 % AI . ( G 10 .E 20 ER .A 8 P W 15 R - C PO 6 10 E 4 5 2 W 0 0 O 2 4 6 8 10 12 14 16 18 20 0 3 6 9 12 15 18 21 24 27 30 33 FREQUENCY (GHz) PIN (dBm) 2 GHz 8 GHz 14 GHz Linear P3dB Psat 4 GHz 10 GHz 16 GHz 6 GHz 12 GHz 18 GHz R & P A

E
Pout vs. Pin P3dB vs. Temperature
45 45 IN 40 40 35 ) S - L m Bm 30 (d R (dB T 35 U 25 3dB PO P IE 20 30 15 LIF P 10 25 0 3 6 9 12 15 18 21 24 27 30 33 2 4 6 8 10 12 14 16 18 20 M PIN (dBm) FREQUENCY (GHz) A 2 GHz 12 GHz 4 GHz 14 GHz 6 GHz 16 GHz +25C +85C -40C 8 GHz 18 GHz 10 GHz Linear
P3dB vs. DC Bias Psat vs. Temperature
45 45 40 40 ) m Bm (dB 35 (d 35 3dB P PSAT 30 30 25 25 2 4 6 8 10 12 14 16 18 20 2 4 6 8 10 12 14 16 18 20 FREQUENCY (GHz) FREQUENCY (GHz) 24V @ 425 mA 24V @ 850 mA +25C +85C -40C 28V @ 425 mA 28V @ 850 mA 32V @ 425 mA 32V @ 850 mA For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D Document Outline Features General Description Functional Diagram Electrical Specifications Gain and Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Gain vs. Bias Pout vs. Frequency Power Gain vs. Frequency Power Added Efficiency vs. Pin Pout vs. Pin P3dB vs. Temperature P3dB vs. DC Bias Psat vs. Temperature Psat vs. DC Bias IDS vs. Pin OIP3 vs. Frequency IM3 vs. Pout/Tone Reverse Isolation vs. Temperature Power Dissipation vs. Pin Second Harmonic Absolute Maximum Ratings[1] Outline Drawing Die Packaging Information Pad Descriptions Bookmark 28 Assembly Diagram Mounting & Bonding Techniques for GaN MMICs