Datasheet HMC981LP3E (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | ACTIVE BIAS CONTROLLER |
| Páginas / Página | 17 / 6 — HMC981LP3E. ACTIVE BIAS CONTROLLER. Absolute Maximum Ratings [1]. Outline … |
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| Idioma del documento | Inglés |
HMC981LP3E. ACTIVE BIAS CONTROLLER. Absolute Maximum Ratings [1]. Outline Drawing. NOTES:. Package Information. 13 - 6
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HMC981LP3E
v01.0411
ACTIVE BIAS CONTROLLER Absolute Maximum Ratings [1]
VDD 12V Thermal Resistance (R ) TH 52.1 °C/W (Junction to package bottom) VG2_CONT, VDRAIN -0.5V to VDD + 0.5V Storage Temperature -65 to +150 °C SW, EN, CP_OUT, VGATEFB, VNEGFB, TRIG_OUT, DISBL_SC, -0.5V to VDIG + 0.5V Operating Temperature -40 to +85 °C ISENSE ESD Sensitivity (HBM) Class 1B VDIG 5.5V Note that there are two different voltage domains on VNEG -4V to GND HMC981LP3E; a high voltage domain Vdd, and a low voltage domain VDIG. Take necessary precautions not to violate ABS VG2 -0.5V to VDD + 0.5V MAX ratings of each subdomains. Junction Temperature 125 °C Continuous Pdiss (T = 85 °C) 0.77 Watts (Derate 19.19 mW/°C above 85 °C) 13 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS T M
Outline Drawing
S - S R LLE O R T N O S C
NOTES:
IA 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. B 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY. 3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 6. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, WHITE INK, OR LASER MARK LOCATED APPROX. AS SHOWN. 7. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm MAX. 8. PACKAGE WARP SHALL NOT EXCEED 0.05mm 9. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 10. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] HMC981LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H981 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C Information furnish F e o d r p by A rnic alo e g , d Devi ecleis vie s rby eli, a eve nd t d to b o p e a l cc a ur c at e o e an r d d releiars ble , p . Ho le we a vesr, e c no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ontact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 2 Elizabeth Drive, Chelmsford, MA 01824 Phon rights of third parties that may result from its use. Specifications subject to change without notice. No e: 9 Ph 7 o 8 n - e 2 : 750 81- - 3 3 2 3 9- 4 4 3 F 70 ax 0 • O : 9 rde 7 r o8 nl-i2 n 50 e at -33 ww 7 w. 3 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. analog.com
13 - 6
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptiptliec.actio o m n Support: Phone: 1-800-ANALOG-D
v01.0411
ACTIVE BIAS CONTROLLER Absolute Maximum Ratings [1]
VDD 12V Thermal Resistance (R ) TH 52.1 °C/W (Junction to package bottom) VG2_CONT, VDRAIN -0.5V to VDD + 0.5V Storage Temperature -65 to +150 °C SW, EN, CP_OUT, VGATEFB, VNEGFB, TRIG_OUT, DISBL_SC, -0.5V to VDIG + 0.5V Operating Temperature -40 to +85 °C ISENSE ESD Sensitivity (HBM) Class 1B VDIG 5.5V Note that there are two different voltage domains on VNEG -4V to GND HMC981LP3E; a high voltage domain Vdd, and a low voltage domain VDIG. Take necessary precautions not to violate ABS VG2 -0.5V to VDD + 0.5V MAX ratings of each subdomains. Junction Temperature 125 °C Continuous Pdiss (T = 85 °C) 0.77 Watts (Derate 19.19 mW/°C above 85 °C) 13 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS T M
Outline Drawing
S - S R LLE O R T N O S C
NOTES:
IA 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. B 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY. 3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 6. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, WHITE INK, OR LASER MARK LOCATED APPROX. AS SHOWN. 7. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm MAX. 8. PACKAGE WARP SHALL NOT EXCEED 0.05mm 9. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 10. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] HMC981LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H981 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C Information furnish F e o d r p by A rnic alo e g , d Devi ecleis vie s rby eli, a eve nd t d to b o p e a l cc a ur c at e o e an r d d releiars ble , p . Ho le we a vesr, e c no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ontact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 2 Elizabeth Drive, Chelmsford, MA 01824 Phon rights of third parties that may result from its use. Specifications subject to change without notice. No e: 9 Ph 7 o 8 n - e 2 : 750 81- - 3 3 2 3 9- 4 4 3 F 70 ax 0 • O : 9 rde 7 r o8 nl-i2 n 50 e at -33 ww 7 w. 3 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. analog.com
13 - 6
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptiptliec.actio o m n Support: Phone: 1-800-ANALOG-D