Datasheet HMC1013LP4E (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.5 - 18.5 GHz |
| Páginas / Página | 8 / 5 — HMC1013LP4E. SUCCESSIVE DETECTION LOG VIDEO. AMPLIFIER (SDLVA), 0.5 - … |
| Formato / tamaño de archivo | PDF / 722 Kb |
| Idioma del documento | Inglés |
HMC1013LP4E. SUCCESSIVE DETECTION LOG VIDEO. AMPLIFIER (SDLVA), 0.5 - 18.5 GHz. Outline Drawing. Package Information
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HMC1013LP4E
v02.0913
SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.5 - 18.5 GHz Outline Drawing
T M S - As LV SD NOTES: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY. 3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 6. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, WHITE INK, OR LASER MARK LOCATED APPROX. AS SHOWN. 7. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm MAX. 8. PACKAGE WARP SHALL NOT EXCEED 0.05mm 9. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 10. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] HMC1013LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H1013 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m
5
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 p o lica rti a o p n S p u s p @ po h rt itt : P ite ho . n c e om : 1-800-ANALOG-D
v02.0913
SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.5 - 18.5 GHz Outline Drawing
T M S - As LV SD NOTES: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY. 3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 6. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, WHITE INK, OR LASER MARK LOCATED APPROX. AS SHOWN. 7. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm MAX. 8. PACKAGE WARP SHALL NOT EXCEED 0.05mm 9. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 10. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] HMC1013LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H1013 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m
5
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 p o lica rti a o p n S p u s p @ po h rt itt : P ite ho . n c e om : 1-800-ANALOG-D