Datasheet STFW4N150, STP4N150, STW4N150 (STMicroelectronics) - 5

FabricanteSTMicroelectronics
DescripciónN-channel 1500 V, 5 Ω, 4 A, PowerMESH Power MOSFET in TO-220, TO-247, TO-3PF
Páginas / Página15 / 5 — STFW4N150, STP4N150, STW4N150. Electrical characteristics. Table 7. …
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STFW4N150, STP4N150, STW4N150. Electrical characteristics. Table 7. Source drain diode. Symbol. Parameter. Test conditions. Min. Typ. Max

STFW4N150, STP4N150, STW4N150 Electrical characteristics Table 7 Source drain diode Symbol Parameter Test conditions Min Typ Max

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STFW4N150, STP4N150, STW4N150 Electrical characteristics Table 7. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit
ISD Source-drain current 4 A - I (1) SDM Source-drain current (pulsed) 12 A V (2) SD Forward on voltage ISD = 4 A, VGS = 0 - 2 V I t SD = 4 A, rr Reverse recovery time 510 ns di/dt = 100 A/µs Qrr Reverse recovery charge - 3 µC V I DD = 45 V RRM Reverse recovery current 12 A Figure 21 I t SD = 4 A, rr Reverse recovery time 615 ns di/dt = 100 A/µs Qrr Reverse recovery charge - 4 µC V I DD = 45 V, Tj = 150°C RRM Reverse recovery current 12.6 A Figure 21 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300µs, duty cycle 1.5% Doc ID 11262 Rev 9 5/15 Document Outline Figure 1. Internal schematic diagram. Table 1. Device summary 1 Electrical ratings Table 2. Absolute maximum ratings Table 3. Thermal data Table 4. Avalanche characteristics 2 Electrical characteristics Table 5. On/off states Table 6. Dynamic Table 7. Source drain diode 2.1 Electrical characteristics (curves) Figure 2. Safe operating area for TO-220 Figure 3. Thermal impedance for TO-220 Figure 4. Safe operating area for TO-3PF Figure 5. Thermal impedance for TO-3PF Figure 6. Safe operating area for TO-247 Figure 7. Thermal impedance for TO-247 Figure 8. Output characteristics Figure 9. Transfer characteristics Figure 10. Transconductance Figure 11. Static drain-source on resistance Figure 12. Gate charge vs gate-source voltage Figure 13. Capacitance variations Figure 14. Normalized gate threshold voltage vs temperature Figure 15. Normalized on resistance vs temperature Figure 16. Source-drain diode forward characteristics Figure 17. Normalized BVDSS vs temperature Figure 18. Maximum avalanche energy vs temperature 3 Test circuits Figure 19. Switching times test circuit for resistive load Figure 20. Gate charge test circuit Figure 21. Test circuit for inductive load switching and diode recovery times Figure 22. Unclamped inductive load test circuit Figure 23. Unclamped inductive waveform Figure 24. Switching time waveform 4 Package mechanical data 5 Revision history Table 8. Document revision history