Datasheet MMBZ5231 to MMBZ5267 (Vishay)

FabricanteVishay
DescripciónSmall Signal Zener Diodes
Páginas / Página4 / 1 — MMBZ5225 to MMBZ5267. Small Signal Zener Diodes. FEATURES. DESIGN SUPPORT …
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Idioma del documentoinglés

MMBZ5225 to MMBZ5267. Small Signal Zener Diodes. FEATURES. DESIGN SUPPORT TOOLS. PRIMARY CHARACTERISTICS. PARAMETER. VALUE. UNIT

Datasheet MMBZ5231 to MMBZ5267 Vishay

Línea de modelo para esta hoja de datos

MMBZ5225
MMBZ5226
MMBZ5227
MMBZ5228
MMBZ5229
MMBZ5230
MMBZ5231
MMBZ5232
MMBZ5233
MMBZ5234
MMBZ5235
MMBZ5236
MMBZ5237
MMBZ5238
MMBZ5239
MMBZ5240
MMBZ5241
MMBZ5242
MMBZ5243
MMBZ5244
MMBZ5245
MMBZ5246
MMBZ5247
MMBZ5248
MMBZ5249
MMBZ5250
MMBZ5251
MMBZ5252
MMBZ5253
MMBZ5254
MMBZ5255
MMBZ5256
MMBZ5257
MMBZ5258
MMBZ5259
MMBZ5260
MMBZ5261
MMBZ5262
MMBZ5263
MMBZ5264
MMBZ5265
MMBZ5266
MMBZ5267

Versión de texto del documento

MMBZ5225 to MMBZ5267
www.vishay.com Vishay Semiconductors
Small Signal Zener Diodes FEATURES
• Silicon planar power Zener diodes Available 3 • Standard Zener voltage tolerance is ± 5 % with a “B” suffix (e.g.: MMBZ5225B), suffix “C” is ± 2 % tolerance. • High temperature soldering guaranteed:  1 2 260 °C/4 x 10 s at terminals • AEC-Q101 qualified available • ESD capability according to AEC-Q101: Human body model > 8 kV
DESIGN SUPPORT TOOLS
click logo to get started Machine model > 800 V • Base P/N-E3 - RoHS-compliant, commercial grade Models Available • Base P/N-HE3 - RoHS-compliant, AEC-Q101 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT
VZ range nom. 3 to 75 V Test current IZT 1.7 to 20 mA VZ specification Thermal equilibrium Circuit configuration Single
ORDERING INFORMATION DEVICE NAME ORDERING CODE TAPED UNITS PER REEL MINIMUM ORDER QUANTITY
MMBZ5225B-E3-08 to MMBZ5267B-E3-08 MMBZ5225C-E3-08 to MMBZ5267C-E3-08 3000 (8 mm tape on 7" reel) 15 000/box MMBZ5225B-HE3-08 to MMBZ5267B-HE3-08 MMBZ5225 to MMBZ5225C-HE3-08 to MMBZ5267C-HE3-08 MMBZ5267 MMBZ5225B-E3-18 to MMBZ5267B-E3-18 MMBZ5225C-E3-18 to MMBZ5267C-E3-18 10 000 (8 mm tape on 13" reel) 10 000/box MMBZ5225B-HE3-18 to MMBZ5267B-HE3-18 MMBZ5225C-HE3-18 to MMBZ5267C-HE3-18
PACKAGE MOLDING COMPOUND MOISTURE SENSITIVITY PACKAGE NAME WEIGHT SOLDERING CONDITIONS FLAMMABILITY RATING LEVEL
MSL level 1 SOT-23 8.8 mg UL 94 V-0 260 °C/10 s at terminals (according J-STD-020)
ABSOLUTE MAXIMUM RATINGS
(Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
On FR - 5 board using recommended solder pad layout Ptot 225 mW Power dissipation On alumina substrate Ptot 300 mW Zener current See table “Electrical Characteristics” Thermal resistance, On FR - 5 board using recommended solder pad layout R junction to ambient air thJA 556 K/W Junction temperature Tj 150 °C Storage temperature range Tstg -65 to +150 °C Operating temperature range Top -55 to +150 °C Rev. 1.9, 13-Feb-18
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Document Number: 85772 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000