Datasheet MC10EL16, MC100EL16 (ON Semiconductor) - 8

FabricanteON Semiconductor
Descripción5.0 V ECL Differential Receiver
Páginas / Página9 / 8 — PACKAGE DIMENSIONS. TSSOP 8. CASE 948R−02. ISSUE A. DATE 04/07/2000. …
Revisión10
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PACKAGE DIMENSIONS. TSSOP 8. CASE 948R−02. ISSUE A. DATE 04/07/2000. SCALE 2:1. 8x REF. 2X L/2. −U−. PIN 1. IDENT. −V−. DETAIL E. MILLIMETERS

PACKAGE DIMENSIONS TSSOP 8 CASE 948R−02 ISSUE A DATE 04/07/2000 SCALE 2:1 8x REF 2X L/2 −U− PIN 1 IDENT −V− DETAIL E MILLIMETERS

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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS TSSOP 8 CASE 948R−02 ISSUE A DATE 04/07/2000 SCALE 2:1 8x REF K
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 0.10 (0.004) M T U S V S 0.15 (0.006) T U S Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
2X L/2
PROTRUSIONS OR GATE BURRS. MOLD FLASH
8 5
0.25 (0.010) OR GATE BURRS SHALL NOT EXCEED 0.15
B
(0.006) PER SIDE.
L −U−
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
1 4 M
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PIN 1
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
IDENT
PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR 0.15 (0.006) T U S
A
REFERENCE ONLY.
F
6. DIMENSION A AND B ARE TO BE DETERMINED
−V−
AT DATUM PLANE -W-.
DETAIL E MILLIMETERS INCHES DIM MIN MAX MIN MAX A
2.90 3.10 0.114 0.122
C B
2.90 3.10 0.114 0.122
C
0.80 1.10 0.031 0.043 0.10 (0.004)
D
0.05 0.15 0.002 0.006
−W− F
0.40 0.70 0.016 0.028
−T− SEATING D G G
0.65 BSC 0.026 BSC
PLANE K
0.25 0.40 0.010 0.016
L
4.90 BSC 0.193 BSC
DETAIL E M
0 6 0 6 _ _ _ _
DOCUMENT NUMBER: 98AON00236D
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DESCRIPTION: TSSOP 8 PAGE 1 OF 1
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