Datasheet ADG1436-EP (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | 1.5 Ω On Resistance, ±15 V/12 V/±5 V, iCMOS , Dual SPDT Switch |
| Páginas / Página | 10 / 6 — ADG1436-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. THERMAL … |
| Formato / tamaño de archivo | PDF / 253 Kb |
| Idioma del documento | Inglés |
ADG1436-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 4. Parameter. Ratings. Table 5. Thermal Resistance
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ADG1436-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS
T
THERMAL RESISTANCE
A = 25°C, unless otherwise noted. Thermal performance is directly linked to printed circuit board
Table 4.
(PCB) design and operating environment. Careful attention to
Parameter Ratings
PCB thermal design is required. VDD to VSS 35 V V θJA is the natural convection junction to ambient thermal DD to GND −0.3 V to +25 V V resistance measured in a one cubic foot sealed enclosure. SS to GND +0.3 V to −25 V Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V or
Table 5. Thermal Resistance
30 mA, whichever occurs first
Package Type1 θ
Digital Inputs1 GND − 0.3 V to V
JA Unit
DD + 0.3 V or 30 mA, whichever occurs first RU-16 112 °C/W Peak Current, S or D 600 mA (pulsed at 1 ms, 10% 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal duty cycle maximum) test board. See JEDEC JESD-51. Continuous Power Dissipation2 See Figure 2 Operating Temperature Range −55°C to +125°C
1.2
Storage Temperature Range −65°C to +150°C Junction Temperature 150°C
) 1.0
Reflow Soldering Peak 260(+0/−5)°C
(W N
Temperature, Pb-Free
IO T 0.8 PA
1 Overvoltages at IN, S, and D are clamped by internal diodes. Current must be
ISSI
limited to the maximum ratings given.
D 0.6
2 Calculated based on Table 3 model.
ER W
Stresses at or above those listed under Absolute Maximum
0.4 M PO
Ratings may cause permanent damage to the product. This is a
MU
stress rating only; functional operation of the product at these
XI 0.2 MA
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond
0
the maximum operating conditions for extended periods may
–55 –35 –15 5 25 45 65 85 105 125
202 affect product reliability.
AMBIENT TEMPERATURE (°C)
17169- Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. 0 | Page 6 of 10 Document Outline Features Applications Enhanced Product Features Functional Block Diagram General Description Revision History Specifications 15 V Dual Supply 12 V Single Supply 5 V Dual Supply Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Truth Table For Switches Typical Performance Characteristics Outline Dimensions Ordering Guide
ADG1436-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS
T
THERMAL RESISTANCE
A = 25°C, unless otherwise noted. Thermal performance is directly linked to printed circuit board
Table 4.
(PCB) design and operating environment. Careful attention to
Parameter Ratings
PCB thermal design is required. VDD to VSS 35 V V θJA is the natural convection junction to ambient thermal DD to GND −0.3 V to +25 V V resistance measured in a one cubic foot sealed enclosure. SS to GND +0.3 V to −25 V Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V or
Table 5. Thermal Resistance
30 mA, whichever occurs first
Package Type1 θ
Digital Inputs1 GND − 0.3 V to V
JA Unit
DD + 0.3 V or 30 mA, whichever occurs first RU-16 112 °C/W Peak Current, S or D 600 mA (pulsed at 1 ms, 10% 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal duty cycle maximum) test board. See JEDEC JESD-51. Continuous Power Dissipation2 See Figure 2 Operating Temperature Range −55°C to +125°C
1.2
Storage Temperature Range −65°C to +150°C Junction Temperature 150°C
) 1.0
Reflow Soldering Peak 260(+0/−5)°C
(W N
Temperature, Pb-Free
IO T 0.8 PA
1 Overvoltages at IN, S, and D are clamped by internal diodes. Current must be
ISSI
limited to the maximum ratings given.
D 0.6
2 Calculated based on Table 3 model.
ER W
Stresses at or above those listed under Absolute Maximum
0.4 M PO
Ratings may cause permanent damage to the product. This is a
MU
stress rating only; functional operation of the product at these
XI 0.2 MA
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond
0
the maximum operating conditions for extended periods may
–55 –35 –15 5 25 45 65 85 105 125
202 affect product reliability.
AMBIENT TEMPERATURE (°C)
17169- Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. 0 | Page 6 of 10 Document Outline Features Applications Enhanced Product Features Functional Block Diagram General Description Revision History Specifications 15 V Dual Supply 12 V Single Supply 5 V Dual Supply Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Truth Table For Switches Typical Performance Characteristics Outline Dimensions Ordering Guide