Datasheet ADG714, ADG715 (Analog Devices) - 9

FabricanteAnalog Devices
DescripciónCMOS, Low Voltage Serially Controlled, Octal SPST Switches
Páginas / Página21 / 9 — Data Sheet. ADG714/. ADG715. ABSOLUTE MAXIMUM RATINGS. THERMAL …
RevisiónE
Formato / tamaño de archivoPDF / 368 Kb
Idioma del documentoInglés

Data Sheet. ADG714/. ADG715. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 6. Parameter. Rating. Table 7. Thermal Resistance

Data Sheet ADG714/ ADG715 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 6 Parameter Rating Table 7 Thermal Resistance

Línea de modelo para esta hoja de datos

Versión de texto del documento

Data Sheet ADG714/ ADG715 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 6.
Thermal performance is directly linked to printed circuit board
Parameter Rating
(PCB) design and operating environment. VDD to VSS 7 V Careful attention to PCB thermal design is required. VDD to GND −0.3 V to +7 V θJA is the natural convection, junction to ambient thermal VSS to GND +0.3 V to −3.5 V resistance measured in a one cubic foot sealed enclosure. θJC is Analog Inputs1 VSS −0.3 V to VDD +0.3 V or the junction to case thermal resistance. 30 mA, whichever occurs first Digital Inputs1 –0.3 V to VDD +0.3 V or 30 mA,
Table 7. Thermal Resistance
whichever occurs first
Package Type θJA θJC Unit
Peak Current, Sx or Dx 100 mA (pulsed at 1 ms, 10% RU-24 128 42 °C/W duty cycle maximum) CP-24-10 127.991 15.382 °C/W Continuous Current, Sx or Dx 30 mA Operating Temperature Range −40°C to +85°C 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal Storage Temperature Range −65°C to +150°C test board. See JEDEC JESD-51. 2 Thermal impedance simulated values are based on a cool plate location at Junction Temperature 150°C the top of the package and measured at the bottom of the exposed paddle Lead Temperature, Soldering 300°C of the LFCSP. (10 sec) Infrared Reflow (20 sec) 235°C
ESD CAUTION
1 Overvoltages at the DIN pin, Sx, or Dx are clamped by internal diodes. Limit current to the given maximum ratings. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. E | Page 9 of 21 Document Outline Features Applications General Description Functional Block Diagrams Product Highlights Revision History Specifications 5 V Single Supply 3 V Single Supply ±2.5 V Dual Supply Timing Characteristics ADG714 ADG715 Timing Diagrams Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Terminology Theory of Operation Power-On Reset Serial Interface 3-Wire Serial Interface 2-Wire Serial Interface Input Shift Register Write Operation Read Operation Applications Information Multiple Devices on One Bus Daisy-Chaining Multiple ADG714 Devices Power Supply Sequencing Decoding Multiple ADG714 Devices Using the ADG739 Outline Dimensions Ordering Guide