Datasheet IRF640, SiHF640 (Vishay) - 2

FabricanteVishay
DescripciónPower MOSFET
Páginas / Página8 / 2 — IRF640, SiHF640. THERMAL RESISTANCE RATINGS. PARAMETER SYMBOL. TYP. MAX. …
Formato / tamaño de archivoPDF / 167 Kb
Idioma del documentoInglés

IRF640, SiHF640. THERMAL RESISTANCE RATINGS. PARAMETER SYMBOL. TYP. MAX. UNIT. SPECIFICATIONS. TEST. CONDITIONS. MIN. Static. Dynamic

IRF640, SiHF640 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP MAX UNIT SPECIFICATIONS TEST CONDITIONS MIN Static Dynamic

Línea de modelo para esta hoja de datos

Versión de texto del documento

IRF640, SiHF640
www.vishay.com Vishay Siliconix
THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient RthJA - 62 Case-to-Sink, Flat, Greased Surface RthCS 0.50 - °C/W Maximum Junction-to-Case (Drain) RthJC - 1.0
SPECIFICATIONS
(TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static
Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 μA 200 - - V VDS Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.29 - V/°C Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = 250 μA 2.0 - 4.0 V Gate-Source Leakage IGSS VGS = ± 20 V - - ± 100 nA VDS = 200 V, VGS = 0 V - - 25 Zero Gate Voltage Drain Current IDSS μA VDS = 160 V, VGS = 0 V, TJ = 125 °C - - 250 Drain-Source On-State Resistance RDS(on) VGS = 10 V ID = 11 A b - - 0.18 Forward Transconductance gfs VDS = 50 V, ID = 11 A b 6.7 - - S
Dynamic
Input Capacitance Ciss V - 1300 - GS = 0 V, Output Capacitance Coss VDS = 25 V, - 430 - pF f = 1.0 MHz, see fig. 5 Reverse Transfer Capacitance Crss - 130 - Total Gate Charge Qg - - 70 I Gate-Source Charge Qgs V D = 18 A, VDS =160 V, GS = 10 V - - 13 nC see fig. 6 and 13 b Gate-Drain Charge Qgd - - 39 Turn-On Delay Time td(on) - 14 - Rise Time tr V - 51 - DD = 100 V, ID = 18 A, ns R Turn-Off Delay Time t g = 9.1 , RD = 5.4, see fig. 10 b d(off) - 45 - Fall Time tf - 36 - D Internal Drain Inductance L Between lead, D - 4.5 - 6 mm (0.25") from package and center of nH G Internal Source Inductance LS die contact - 7.5 - S Gate Input Resistance Rg f = 1 MHz, open drain 0.5 - 3.6
Drain-Source Body Diode Characteristics
MOSFET symbol Continuous Source-Drain Diode Current I D S - - 18 showing the  integral reverse A G Pulsed Diode Forward Current a ISM p - n junction diode - - 72 S Body Diode Voltage VSD TJ = 25 °C, IS = 18 A, VGS = 0 V b - - 2.0 V Body Diode Reverse Recovery Time trr - 300 610 ns TJ = 25 °C, IF = 18 A, dI/dt = 100 A/μs b Body Diode Reverse Recovery Charge Qrr - 3.4 7.1 μC Forward Turn-On Time ton Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width  300 μs; duty cycle  2 %. S15-2667-Rev. C, 16-Nov-15
2
Document Number: 91036 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000