Datasheet TDA8920CTH (NXP) - 2

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NXP Semiconductors TDA8920C 2
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110 W class-D power amplifier 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit General, V [1] P =
±
30 V
VP supply voltage Operating mode [2] ±12.5 ±30 ±32.5 V V − P(ovp) overvoltage protection supply voltage Standby, Mute modes; VDD VSS 65 - 70 V Iq(tot) total quiescent current Operating mode; no load; no filter; no - 50 75 mA RC-snubber network connected
Stereo single-ended configuration
Po output power Tj = 85 °C; LLC = 22 µH; CLC = 680 nF (see Figure 10) THD + N = 10 %; R [3] L = 4 Ω; - 110 - W VP = ±30 V THD + N = 10 %; RL = 4 Ω; - 90 - W VP = ±27 V
Mono bridge-tied load configuration
P [3] o output power Tj = 85 °C; LLC = 22 µH; CLC = 680 nF - 220 - W (see Figure 10); RL = 8 Ω; THD + N = 10 %; VP = ±30 V [1] VP is the supply voltage on pins VDDP1, VDDP2 and VDDA. [2] The circuit is DC adjusted at VP = ±12.5 V to ±32.5 V. [3] Output power is measured indirectly; based on RDSon measurement; see Section 13.3.
5. Ordering information Table 2. Ordering information Type number Package Name Description Version
TDA8920CJ DBS23P plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) SOT411-1 TDA8920CTH HSOP24 plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3 TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 2 of 39
Document Outline 1. General description 2. Features 3. Applications 4. Quick reference data 5. Ordering information 6. Block diagram 7. Pinning information 7.1 Pinning 7.2 Pin description 8. Functional description 8.1 General 8.2 Pulse-width modulation frequency 8.3 Protection 8.3.1 Thermal protection 8.3.1.1 Thermal FoldBack (TFB) 8.3.1.2 OverTemperature Protection (OTP) 8.3.2 OverCurrent Protection (OCP) 8.3.3 Window Protection (WP) 8.3.4 Supply voltage protection 8.4 Differential audio inputs 9. Limiting values 10. Thermal characteristics 11. Static characteristics 12. Dynamic characteristics 12.1 Switching characteristics 12.2 Stereo SE configuration characteristics 12.3 Mono BTL application characteristics 13. Application information 13.1 Mono BTL application 13.2 Pin MODE 13.3 Estimating the output power 13.3.1 Single-Ended (SE) 13.3.2 Bridge-Tied Load (BTL) 13.4 External clock 13.5 Heatsink requirements 13.6 Pumping effects 13.7 Application schematic 13.8 Curves measured in reference design 14. Package outline 15. Soldering of SMD packages 15.1 Introduction to soldering 15.2 Wave and reflow soldering 15.3 Wave soldering 15.4 Reflow soldering 16. Soldering of through-hole mount packages 16.1 Introduction to soldering through-hole mount packages 16.2 Soldering by dipping or by solder wave 16.3 Manual soldering 16.4 Package related soldering information 17. Revision history 18. Legal information 18.1 Data sheet status 18.2 Definitions 18.3 Disclaimers 18.4 Trademarks 19. Contact information 20. Contents