Datasheet MCP6V76 (Microchip) - 3

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MCP6V76/6U/7/9 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings †
VDD – VSS ...6.5V Current at Input Pins ..±2 mA Analog Inputs (VIN+ and VIN-)
(Note 1)
...VSS – 1.0V to VDD+1.0V All Other Inputs and Outputs ..VSS – 0.3V to VDD+0.3V Difference Input Voltage ...|VDD – VSS| Output Short Circuit Current ... Continuous Current at Output and Supply Pins ..±30 mA Storage Temperature ...-65°C to +150°C Maximum Junction Temperature .. +150°C ESD protection on all pins (HBM, CDM, MM) MCP6V76/6U   4 kV, 1.5 kV, 400V MCP6V77/9  4 kV, 1.5 kV, 300V
† Notice:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Note 1:
See
Section 4.2.1, Rail-to-Rail Inputs
.
1.2 Specifications TABLE 1-1: DC ELECTRICAL SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, TA = +25°C, VDD = +2V to +5.5V, VSS = GND, VCM = VDD/3,VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF (refer to Figures 1-4 and 1-5).
Parameters Sym. Min. Typ. Max. Units Conditions Input Offset
Input Offset Voltage VOS -25 — +25 µV TA = +25°C Input Offset Voltage Drift with TC1 -150 — +150 nV/°C TA = -40 to +125°C, Temperature (Linear Temp. Co.)
(Note 1)
Input Offset Voltage Quadratic TC2 — -30 — pV/°C2 TA = -40 to +125°C Temp. Co. Input Offset Voltage Aging ∆VOS — ±0.75 — µV 408 hours Life Test at +150°, measured at +25°C Power Supply Rejection Ratio PSRR 110 125 — dB
Input Bias Current and Impedance
Input Bias Current IB -50 ±1 +50 pA Input Bias Current across IB — +20 — pA TA = +85°C Temperature IB 0 +0.2 +1.5 nA TA = +125°C Input Offset Current IOS -250 ±60 +250 pA Input Offset Current across IOS — ±50 — pA TA = +85°C Temperature IOS -800 ±50 +800 pA TA = +125°C
Note 1:
For design guidance only; not tested.  2020 Microchip Technology Inc. DS20006323B-page 3 Document Outline 170 µA, 2 MHz Zero-Drift Op Amps Features Typical Applications Design Aids Related Parts Description Package Types Typical Application Circuit 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Timing Diagrams FIGURE 1-1: Amplifier Start Up. FIGURE 1-2: Offset Correction Settling Time. FIGURE 1-3: Output Overdrive Recovery. 1.4 Test Circuits FIGURE 1-4: AC and DC Test Circuit for Most Noninverting Gain Conditions. FIGURE 1-5: AC and DC Test Circuit for Most Inverting Gain Conditions. FIGURE 1-6: Test Circuit for Dynamic Input Behavior. 2.0 Typical Performance Curves 2.1 DC Input Precision FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage Quadratic Temp. Co. FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage with VCM = VCML. FIGURE 2-5: Input Offset Voltage vs. Power Supply Voltage with VCM = VCMH. FIGURE 2-6: Input Offset Voltage vs. Output Voltage with VDD = 2.0V. FIGURE 2-7: Input Offset Voltage vs. Output Voltage with VDD = 5.5V. FIGURE 2-8: Input Offset Voltage vs. Common Mode Voltage with VDD = 2V. FIGURE 2-9: Input Offset Voltage vs. Common Mode Voltage with VDD = 5.5V. FIGURE 2-10: CMRR and PSRR vs. Ambient Temperature. FIGURE 2-11: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-12: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +85°C. FIGURE 2-13: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +125°C. FIGURE 2-14: Input Bias and Offset Currents vs. Ambient Temperature with VDD = +5.5V. FIGURE 2-15: Input Bias Current vs. Input Voltage (below VSS). 2.2 Other DC Voltages and Currents FIGURE 2-16: Input Common Mode Voltage Headroom (Range) vs. Ambient Temperature. FIGURE 2-17: Output Voltage Headroom vs. Output Current. FIGURE 2-18: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-19: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-20: Supply Current vs. Power Supply Voltage. FIGURE 2-21: Power-On Reset Voltage vs. Ambient Temperature. 2.3 Frequency Response FIGURE 2-22: CMRR and PSRR vs. Frequency. FIGURE 2-23: Open-Loop Gain vs. Frequency with VDD = 2V. FIGURE 2-24: Open-Loop Gain vs. Frequency with VDD = 5.5V. FIGURE 2-25: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. FIGURE 2-26: Gain Bandwidth Product and Phase Margin vs. Common Mode Input Voltage. FIGURE 2-27: Gain Bandwidth Product and Phase Margin vs. Output Voltage. FIGURE 2-28: Closed-Loop Output Impedance vs. Frequency with VDD = 2V. FIGURE 2-29: Closed-Loop Output Impedance vs. Frequency with VDD = 5.5V. FIGURE 2-30: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-31: EMIRR vs Frequency. FIGURE 2-32: EMIRR vs RF Input Peak Voltage. FIGURE 2-33: Channel-to-Channel Separation vs. Frequency. 2.4 Input Noise and Distortion FIGURE 2-34: Input Noise Voltage Density and Integrated Input Noise Voltage vs. Frequency. FIGURE 2-35: Input Noise Voltage Density vs. Input Common Mode Voltage. FIGURE 2-36: Intermodulation Distortion vs. Frequency with VCM Disturbance (see Figure 1-6). FIGURE 2-37: Intermodulation Distortion vs. Frequency with VDD Disturbance (see Figure 1-6). FIGURE 2-38: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 2V. FIGURE 2-39: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 5.5V. 2.5 Time Response FIGURE 2-40: Input Offset Voltage vs. Time at Power-Up. FIGURE 2-41: The MCP6V76/6U/7/9 Family Shows No Input Phase Reversal with Overdrive. FIGURE 2-42: Noninverting Small Signal Step Response. FIGURE 2-43: Noninverting Large Signal Step Response. FIGURE 2-44: Inverting Small Signal Step Response. FIGURE 2-45: Inverting Large Signal Step Response. FIGURE 2-46: Slew Rate vs. Ambient Temperature. FIGURE 2-47: Output Overdrive Recovery vs. Time with G = -10 V/V. FIGURE 2-48: Output Overdrive Recovery Time vs. Inverting Gain. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Applications 4.1 Overview of Zero-Drift Operation FIGURE 4-1: Simplified Zero-Drift Op Amp Functional Diagram. FIGURE 4-2: First Chopping Clock Phase; Equivalent Amplifier Diagram. FIGURE 4-3: Second Chopping Clock Phase; Equivalent Amplifier Diagram. 4.2 Other Functional Blocks FIGURE 4-4: Simplified Analog Input ESD Structures. FIGURE 4-5: Protecting the Analog Inputs Against High Voltages. FIGURE 4-6: Protecting the Analog Inputs Against High Currents. 4.3 Application Tips FIGURE 4-7: Output Resistor, RISO, Stabilizes Capacitive Loads. FIGURE 4-8: Recommended RISO Values for Capacitive Loads. FIGURE 4-9: Output Load. FIGURE 4-10: Amplifier with Parasitic Capacitance. 4.4 Typical Applications FIGURE 4-11: Simple Design. FIGURE 4-12: RTD Sensor. FIGURE 4-13: Offset Correction. FIGURE 4-14: Precision Comparator. 5.0 Design Aids 5.1 Microchip Advanced Part Selector (MAPS) 5.2 Analog Demonstration and Evaluation Boards 5.3 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Revision B (April 2020) Revision A (March 2020) Product Identification System Trademarks Worldwide Sales and Service