Datasheet TDA7056B (NXP) - 5

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CHARACTERISTICS
VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 ; Tamb = 25 C; unless otherwise specified (see Fig.13).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply
VP positive supply voltage 4.5  18 V Iq(tot) total quiescent current note 1; RL =   9.2 13 mA
Maximum gain (V5 = 1.4 V)
PO output power THD = 10%; RL = 16 3 3.5  W THD = 10%; RL = 8 5 5.5  W THD total harmonic distortion PO = 0.5 W  0.3 1 % Gv(max) maximum total voltage gain 39.5 40.5 41.5 dB VI input signal handling (RMS value) Gv(max) = 0 dB; THD  1% 1.0   V Vno noise output voltage (RMS value) note 2; f = 500 kHz  210  V B bandwidth at 1 dB  0.02 to 300  kHz SVRR supply voltage ripple rejection note 3 34 38  dB V     O DC output offset voltage V8 v6 0 200 mV ZI input impedance (pin 3) 15 20 25 k
Mute position
V   O output voltage in mute position note 4; V5 0.4 V; 35 45 V VI = 1.0 V
DC volume control;
note 5  gain control 68 73.5  dB I5 control current V5 = 0 V 20 25 30 A
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by RL. 2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 and B = 5 kHz. 3. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV (RMS value) is applied to the positive supply rail. 4. The noise output voltage (RMS value) is measured with RS = 5 k unweighted. 5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15. The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage gain. 1997 Aug 15 5 Document Outline Features General description Quick reference data Ordering information Block diagram Pinning Functional description Power dissipation Limiting values Thermal characteristics Characteristics Test and application information Package outline Soldering Introduction Soldering by dipping or by wave Repairing soldered joints Data sheet status Definitions Disclaimers