Datasheet Q6012LTH1LED (Littelfuse) - 5

Teccor® brand Thyristors
12 Amp Alternistor Quadrac for LED dimmer applications
Soldering Parameters
Reflow Condition Pb – Free assembly
t T
P P - Temperature Min (T ) 150°C s(min)
e Ramp-up Ramp-u
Pre Heat - Temperature Max (T ) 200°C
T
L s(max)
t T
L - Time (min to max) (t ) 60 – 180 secs S(max) s
Ramp-dow Ramp-do n
Average ramp up rate (Liquidus Temp)
mperatur Preheat Preheat
5°C/second max
e
(T ) to peak
T
L
T
S(min) T to T - Ramp-up Rate 5°C/second max
t
S S(max) L - Temperature (T ) (Liquidus) 217°C Reflow L
25
- Temperature (t ) 60 – 150 seconds
time to peak temperature
L
Time
Peak Temperature (T ) 260°C +0/-5 P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 280°C
Physical Specifications Environmental Specifications
Test Specifications and Conditions
Terminal Finish
1005 Matte Tin-plated MIL-STD-750: Method 1040, Condition A
High Temperature
Rated V (VAC-peak), 110°C, 1008
Voltage Blocking
DRM UL Recognized epoxy meeting hours
Body Material
flammability classification 94v-0 MIL-STD-750: Method 1051
Temperature Cycling
-40°C to 150°C, 15-minute dwell, 100 cycles
Lead Material
Copper Alloy
Biased Temperature &
EIA/JEDEC: JESD22-A101
Humidity
320VDC, 85°C, 85%RH, 1008 hours MIL-STD-750: Method 1031
High Temp Storage Design Considerations
150°C, 1008 hours
Low-Temp Storage
-40°C, 1008 hours Careful selection of the correct device for the application’s operating parameters and environment will go a long way
Resistance to
MIL-STD-750: Method 2031 toward extending the operating life of the Thyristor. Good
Solder Heat
260°C, 10 seconds design practice should limit the maximum continuous
Solderability
ANSI/J-STD-002, Category 3, Test A current through the main terminals to 75% of the device
Lead Bend
MIL-STD-750: Method 2036, Condition E rating. Other ways to ensure long life for a power discrete semiconductor are proper heat sinking and selection of voltage ratings for worst case conditions. Overheating, overvoltage (including dv/dt), and surge currents are the main killers of semiconductors. Correct mounting, soldering, and forming of the leads also help protect against component damage. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/02/16