Datasheet BAS321 (Nexperia) - 2
| Fabricante | Nexperia |
| Descripción | General purpose diode |
| Páginas / Página | 8 / 2 — Nexperia. BAS321. General purpose diode. 6. Ordering information Table 3. … |
| Revisión | 09202410 |
| Formato / tamaño de archivo | PDF / 194 Kb |
| Idioma del documento | Inglés |
Nexperia. BAS321. General purpose diode. 6. Ordering information Table 3. Ordering information. Type number. Package Name
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Nexperia BAS321 General purpose diode 6. Ordering information Table 3. Ordering information Type number Package Name Description Version
BAS321 SOD323 plastic, surface-mounted package; 2 leads; 1.3 mm pitch; SOD323 1.7 mm x 1.25 mm x 0.95 mm body
7. Marking Table 4. Marking codes Type number Marking code
BAS321 A7
8. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse - 250 V voltage VR reverse voltage - 200 V IF forward current [1] - 250 mA IFSM non-repetitive peak tp = 10 ms; square wave; Tj(init) = 25 °C - 1.7 A forward current tp = 1 µs; square wave; Tj(init) = 25 °C - 9 A tp = 100 µs; square wave; Tj(init) = 25 °C - 3 A IFRM repetitive peak forward tp ≤ 0.5 ms; δ ≤ 0.25 - 625 mA current Ptot total power dissipation Tamb = 25 °C [1] - 300 mW Tj junction temperature - 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from [1] - - 366 K/W junction to ambient Rth(j-sp) thermal resistance from [2] - - 130 K/W junction to solder point [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Soldering point of cathode tab. BAS321 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2024. Al rights reserved
Product data sheet 9 October 2024 2 / 8
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents
Nexperia BAS321 General purpose diode 6. Ordering information Table 3. Ordering information Type number Package Name Description Version
BAS321 SOD323 plastic, surface-mounted package; 2 leads; 1.3 mm pitch; SOD323 1.7 mm x 1.25 mm x 0.95 mm body
7. Marking Table 4. Marking codes Type number Marking code
BAS321 A7
8. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse - 250 V voltage VR reverse voltage - 200 V IF forward current [1] - 250 mA IFSM non-repetitive peak tp = 10 ms; square wave; Tj(init) = 25 °C - 1.7 A forward current tp = 1 µs; square wave; Tj(init) = 25 °C - 9 A tp = 100 µs; square wave; Tj(init) = 25 °C - 3 A IFRM repetitive peak forward tp ≤ 0.5 ms; δ ≤ 0.25 - 625 mA current Ptot total power dissipation Tamb = 25 °C [1] - 300 mW Tj junction temperature - 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from [1] - - 366 K/W junction to ambient Rth(j-sp) thermal resistance from [2] - - 130 K/W junction to solder point [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Soldering point of cathode tab. BAS321 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2024. Al rights reserved
Product data sheet 9 October 2024 2 / 8
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents